Semiconductor package and methods of manufacturing the semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsChul-Yong Jang, Pyoung-Wan Kim, Teak-Hoon Lee
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Abstract
A semiconductor package and a method of manufacturing the semiconductor package are provided. A semiconductor package according to the present general inventive concept may include a base substrate having one surface on which a connection terminal is formed and a first package substrate having a molding layer covering the base substrate. The molding layer faces a circumference of the connection terminal and includes a side surface having first and second surfaces having a circumference of a different size, respectively.
Claims14
A semiconductor package, comprising:
- a first package substrate including a base substrate having one surface on which a connection terminal is formed and a molding layer covering the base substrate,
- wherein the molding layer has a side surface facing a circumference of the connection terminal, and
- wherein the side surface includes a first surface and a second surface having circumferences of a different size.
13-32. (canceled)
A semiconductor package, comprising:
- a first package substrate including a base substrate having a preliminary connection terminal and a molding layer to cover a portion of the preliminary connection terminal,
- wherein the first package substrate is combined with a second package substrate, and
- wherein the molding layer in which a region adjacent to the preliminary connection terminal is recessed.
Dependencies are inferred from the claim text.