US 2009/0289352 A1 · SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Abstract

A semiconductor device includes: a first substrate, having a grounding layer and holes formed therein for filling with an electroconductive material; a semiconductor chip over such first substrate; and an electroconductive heat releasing member, electrically coupled to the semiconductor chip able to release heat from the semiconductor chip. The heat releasing member includes a ceiling section covering the surface of the semiconductor chip and side surface extending from the ceiling section toward the sides of the first substrate. The ceiling section of the heat releasing member and the side surface sections are formed to compose an integral member. Tips of the side surface sections are inserted in the respective holes of the first substrate. The tips of the side surface section, in turn, are fixed in the inside of the respective holes with the electroconductive material, and the tips are electrically coupled to the grounding layer through the electroconductive material.

Claims8

Dependent claims

A semiconductor device, comprising:

a first substrate, having a grounding layer and a hole formed therein;
a semiconductor chip disposed over said first substrate;
and
an electroconductive heat releasing member, electrically coupled to said semiconductor chip and releasing heat from said semiconductor chip,
wherein said heat releasing member comprises a ceiling section covering the surface of said semiconductor chip and a side surface section extending from said ceiling section toward the side of said first substrate, and said ceiling section and said side surface section are formed to compose an integral member, and
wherein a tip of said side surface section is inserted in said hole of said first substrate, and is fixed in the inside of said hole by an electroconductive material buried in the inside of said hole, and is electrically coupled to said grounding layer at the side wall of said hole via said electroconductive material.

3 more elements

A method for manufacturing a semiconductor device, including:

preparing a first substrate having a grounding layer and a hole formed therein;
installing a semiconductor chip over said first substrate;
and
fixing an electroconductive heat releasing member over said first substrate, said electroconductive heat releasing member being electrically coupled to said semiconductor chip and releasing heat from said semiconductor chip;
wherein said heat releasing member comprises a ceiling section covering said semiconductor chip and a side surface section extending from said ceiling section toward the side of said first substrate, and said ceiling section and said side surface section are formed to compose an integral member, and
wherein, in said fixing said heat releasing member, a tip of the side surface section of said heat releasing member is inserted in said hole of said first substrate, and the tip of said side surface section is electrically coupled to said grounding layer through said electroconductive material by filling the inside of said hole with electroconductive material, and the tip of said side surface section is fixed in the inside of the hole by the electroconductive material.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device and a method for manufacturing the semiconductor device

Life of this patent

Semiconductor device and a method for manufacturing the semiconductor device

Life of this patent

Abstract

Claims8