Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package
AssigneeNEC Corporation
InventorShinji Watanabe
Life of this patent
Estimating the term…
Abstract
Disclosed is a semiconductor package wherein a semiconductor chip is mounted on one surface of a substrate. In this semiconductor package, an inflection point forming portion made of a material having a higher coefficient of thermal expansion than the substrate is formed in a part of the substrate surface on which the semiconductor chip is mounted.
Claims31
1-18. (canceled)
A semiconductor package comprising:
- a substrate;
- a semiconductor chip mounted on one surface of said substrate;
- and
- an inflection point forming portion formed in a part of the surface of said substrate on which said semiconductor chip is mounted, and said inflection point forming portion being made of a material having a larger coefficient of thermal expansion than said substrate.
A semiconductor package comprising:
- a substrate;
- a semiconductor chip mounted on one surface of said substrate;
- and
- an inflection point forming portion formed in a part of a surface of said substrate opposite to the surface on which said semiconductor chip is mounted, and said inflection point forming portion being made of a material having a smaller coefficient of thermal expansion than said substrate.
A substrate for mounting a semiconductor chip thereon, comprising:
- an inflection point forming portion formed in a part of a surface of said substrate on which said semiconductor chip is mounted, and said inflection point forming portion being made of a material having a larger coefficient of thermal expansion than said substrate.
A substrate for mounting a semiconductor chip thereon, comprising:
- an inflection point forming portion formed in a part of a surface of said substrate opposite to a surface on which said semiconductor chip is mounted, and said inflection point forming portion being made of a material having a smaller coefficient of thermal expansion than said substrate.
A method for correcting warping in a semiconductor package which has a semiconductor chip mounted on one surface of a substrate, comprising:
- forming an inflection point forming portion made of a material exhibiting a larger coefficient of thermal expansion than said substrate in a part of the surface on which said semiconductor chip is mounted;
- and
- performing a thermal step.
A method for correcting warping in a semiconductor package which has a semiconductor chip mounted on one surface of a substrate, comprising:
- forming an inflection point forming portion made of a material exhibiting a smaller coefficient of thermal expansion than said substrate in a part of the surface opposite to the surface on which said semiconductor chip is mounted;
- and
- performing a thermal step.
Dependencies are inferred from the claim text.