Electronic device package and fabrication method thereof
AssigneeXintec Inc.
InventorsChia-Lun TSAI, Wen-Cheng CHIEN, Po-Han LEE, Wei-Ming CHEN
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Abstract
An electronic device package and a fabrication method thereof are provided. The fabrication method includes providing a semiconductor substrate containing a plurality of chips having a first surface and an opposite second surface. A plurality of conductive electrodes is disposed on the first surface and the conductive electrodes of the two adjacent chips are arranged asymmetrically along side direction of the chip. A plurality of contact holes is formed in each chip, apart from the side of the chip, to expose the conductive electrodes.
Claims19
An electronic device package, comprising:
- a semiconductor substrate, containing a plurality of chips, wherein each chip has a first surface and an opposite second surface;
- a plurality of conductive electrodes disposed on or over the first surface of each chip, wherein the conductive electrodes on the two adjacent chips are arranged asymmetrically along a side direction of the chip;
- and
- a plurality of contact holes formed in each chip to expose the conductive electrodes.
A method for fabricating an electronic device package, comprising:
- providing a semiconductor substrate, containing a plurality of chips, wherein a scribe line is between the two adjacent chips, and each chip has a first surface and an opposite second surface;
- providing a plurality of conductive electrodes on or over the first surface of each chip, wherein the conductive electrodes on the two adjacent chips are arranged asymmetrically along a side direction of the chip;
- and
- forming a plurality of contact holes in each chip to expose the conductive electrodes.
Dependencies are inferred from the claim text.