Semiconductor device
AssigneeFuji Electric Device Technology Co., Ltd.
InventorAkira Morozumi
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Abstract
A semiconductor device includes an insulating substrate; at least one semiconductor element mounted on a first principal surface of the insulating substrate; and a heat radiator joined through a solder member to a second principal surface of the insulating substrate opposite to the first principal surface on which the semiconductor element is mounted. The solder member contains at least tin and antimony, and the antimony content of the solder member is in a range of from 7% by weight to 15% by weight, both inclusively. Thus, reliability of the semiconductor device is improved.
Claims10
A semiconductor device comprising:
- an insulating substrate having opposite first and second principal surfaces;
- at least one semiconductor element mounted on the first principal surface;
- and
- a heat radiator joined through a solder member to the second principal surface,
- wherein the solder member contains at least tin and antimony;
- and the antimony content of the solder member is in a range from 7% by weight to 15% by weight, both inclusively.
Dependencies are inferred from the claim text.