Back to results
US 2009/0289339 A1Published application
Semiconductor package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChia Chien HU, Chao Cheng Liu, Chien Liu, Chih Ming Chung
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier, and is mounted on the carrier. The encapsulant is adapted to seal the chip and the stiffener.
Claims20
A semiconductor package comprising:
- a carrier;
- a chip disposed on the carrier and electrically connected to the carrier;
- a stiffener disposed around the chip, directly contacting the carrier, and mounted on the carrier;
- and
- an encapsulant adapted to seal the chip and cover the stiffener.
2 more elements
A method for manufacturing semiconductor packages comprising the following steps of:
- providing a carrier, wherein the carrier includes at least one first positioning hole;
- disposing at least one chip on the carrier;
- disposing a stiffener on the carrier, wherein the stiffener directly contacting the carrier, the stiffener is disposed around the chip, and the stiffener comprises at least one second positioning hole corresponding to the first positioning hole;
- temporarily mounting the stiffener on the carrier by an alignment step;
- and
- sealing the chip and the stiffener and mounting the stiffener on the substrate by an encapsulation step so as to form at least one semiconductor package.
3 more elements
Dependencies are inferred from the claim text.