Semiconductor chip and semiconductor device, and method of manufacturing the same
AssigneeNEC Electronics Corporation
InventorKoji Ueta
Life of this patent
Estimating the term…
Abstract
At least a part of an outer edge of a surface where a circuit forming region, for example, of a semiconductor substrate that forms a semiconductor chip is arranged (a region surrounded by a scribe line around the circuit forming region) is cut or polished, so as to form a smooth slope is chamfered non-parallel and non-vertical to the circuit forming region. Then, a code indicating management information is assigned to the slope. Further, a plurality of semiconductor chips are stacked to manufacture a semiconductor device.
Claims5
A semiconductor chip comprising:
- first and second principal surfaces that are opposed to each other;
- and
- a slope that is non-parallel and non-vertical to the first principal surface, the slope being formed by chamfering at least a part of an outer edge of the first principal surface,
- wherein a semiconductor circuit is formed on at least one of the first and second principal surfaces, and information is displayed on the slope.
A semiconductor device comprising:
- a semiconductor chip including first and second principal surfaces that are opposed to each other, and a slope that is non-parallel and non-vertical to the first principal surface, the slope being formed by chamfering at least a part of an outer edge of the first principal surface;
- and
- another semiconductor chip that is stacked on the first principal surface of the semiconductor chip,
- wherein a semiconductor circuit is formed on at least one of the first and second principal surfaces, and information is displayed on the slope.
A method of manufacturing a semiconductor chip including first and second principal surfaces that are opposed to each other and a semiconductor circuit that is formed in at least one of the first and second principal surfaces, the method comprising:
- chamfering at least a part of an outer edge of the first principal surface in a way that the part is non-parallel and non-vertical to the first principal surface;
- and
- assigning information to the slope that is formed by the chamfering.
A method of manufacturing a semiconductor device, comprising:
- chamfering at least a part of an outer edge of a first principal surface of a semiconductor chip including first and second principal surfaces that are opposed to each other and a semiconductor circuit that is formed on at least one of the first and second principal surfaces in a way that the part is non-parallel and non-vertical to the first principal surface, and assigning information to a slope that is formed by the chamfering;
- and
- stacking another semiconductor chip on the first principal surface of the semiconductor chip.
Dependencies are inferred from the claim text.