Back to results
US 2009/0289318 A1Published application
Electronics device package and fabrication method thereof
AssigneeXintec Inc.
InventorsChia-Sheng Lin, Yu-Ting Huang, Chih-Lung Lai
Life of this patent
Estimating the term…
Abstract
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.
Claims16
An electronic device package, comprising:
- a semiconductor chip having a substrate;
- a supporting brick separated from the substrate by a distance;
- and
- a bonding pad having a surface across the substrate and the supporting brick.
1 more element
A method for fabricating an electronic device package, comprising:
- providing a wafer with a substrate having a plurality of die regions, wherein a plurality of semiconductor chips are supported by or formed on the substrate and a plurality of bonding pad are formed on the substrate;
- and
- packaging the substrate at a wafer level, comprising:
- patterning the substrate to form a supporting brick in each die region for separating the supporting brick from the substrate by a distance and exposing the bonding pad.
1 more element
Dependencies are inferred from the claim text.