Silicon carbide semiconductor device and method of manufacturing the same
AssigneeDenso Corporation
InventorsHideo Matsuki, Eiichi Okuno, Naohiro Suzuki
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AssigneeDenso Corporation
InventorsHideo Matsuki, Eiichi Okuno, Naohiro Suzuki
Estimating the term…
An SiC semiconductor device includes a substrate, a drift layer disposed on a first surface of the substrate, a base region disposed above the drift layer, a source region disposed above the base region, a trench penetrating the source region and the base region to the drift layer, a gate insulating layer disposed on a surface of the trench, a gate electrode disposed on a surface of the gate insulating layer, a first electrode electrically coupled with the source region and the base region, a second electrode disposed on the second surface of the substrate, and a second conductivity-type layer disposed at a portion of the base region located under the source region. The second conductivity-type layer has the second conductivity type and has an impurity concentration higher than the base region.
A silicon carbide semiconductor device comprising:
A method of manufacturing a silicon carbide semiconductor device, comprising:
Dependencies are inferred from the claim text.