System And Method For Manufacturing A Thin-film Device
AssigneeHewlett-Packard Development Company, L.P.
InventorsRandy Hoffman, Gregory Herman
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Abstract
A thin-film device includes a plurality of circuit components defining an operational region of the thin-film device, an unpatterned channel portion (108, 340) disposed on the plurality of circuit components, and a patterned passivation dielectric (380,385) selectively disposed on the unpatterned channel portion (108,340) to electrically pattern an active region of the unpatterned channel portion (108,340).
Claims10
A thin-film device comprising:
- a plurality of thin-film device components defining an operational region of said thin-film device;
- an unpatterned channel portion (108, 340) disposed adjacent to said plurality of thin-film device components;
- and
- a patterned passivation dielectric (380, 385) selectively disposed on said unpatterned channel portion (108, 340) to electrically pattern an active region of said unpatterned channel portion (108, 340).
A method of spatially selecting active and inactive regions of a thin-film device channel film comprising disposing a patterned passivation dielectric (380, 385) on an unpatterned channel layer (108, 340), wherein said patterned passivation dielectric (380, 385) includes at least two passivation dielectrics.
A method of spatially defining active and inactive regions of an unpatterned thin-film device channel film comprising:
- disposing at least two passivation dielectrics adjacent to said unpatterned thin-film device channel film;
- and
- selectively damaging areas of said unpatterned channel film.
Dependencies are inferred from the claim text.