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OwnerYong Du, John Yan +1inventors
InventorsYong Du, John Yan, Niranjan Vijayaragavan
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A method is provided for solder reflow which includes the steps of providing a receptacle having receptacle pads formed on an upper surface and placing a component on the receptacle, the component having a ball grid array of solder balls attached thereto. The component is placed on the receptacle in a manner which aligns the solder balls with the receptacle pads on the receptacle. The method further includes the steps of placing a weight having a predetermined size and a predetermined mass on top of the component to form a stack of the receptacle, the component and the weight, and reflowing the stack to attach the component to the receptacle by exposing the stack to high temperature to reflow the solder balls.
A method for solder reflow comprising the steps of:
A package-on-package (POP) fabrication method for formation of a POP device comprising the steps of:
A weight for assisting solder ball attachment of a component having a ball grid array (BGA) to a receptacle during a BGA wetting process, the weight having a predetermined size and a predetermined mass, the predetermined size determined in response to a surface area the component and the predetermined mass determined in response to coefficient of thermal expansion mismatch of elements of the component.
Dependencies are inferred from the claim text.