Method and apparatus for rework soldering
AssigneeFujitsu Limited
InventorsTetsuji Ishikawa, Yukihiko Oashi, Shizuo Ishijima
Life of this patent
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Abstract
A method is disclosed for performing rework soldering for removing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board. The method includes the steps of positioning a dual structure body including a heating member and a cooling member between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated toward the rework target, the cooling member being situated toward the non-rework target; heating the heating member; and cooling the cooling member.
Claims12
A method for performing rework soldering for replacing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board, the method comprising the steps of:
- positioning a dual structure body including a heating member and a cooling member between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated towards the rework target, the cooling member being situated towards the non-rework target;
- heating the heating member;
- and
- cooling the cooling member.
An apparatus for performing rework soldering for replacing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board, the apparatus comprising:
- a dual structure body including a heating member and a cooling member positioned between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated towards the rework target, the cooling member being situated towards the non-rework target.
Dependencies are inferred from the claim text.