Wire bonding method
AssigneeOki Semiconductor Co., Ltd.
InventorShinsuke Suzuki
Life of this patent
Estimating the term…
Abstract
A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact therewith when the lead frame is provided on the heat plate such that the first main surface of the lead frame faces toward heat plate. A duct is provided in the heat plate to connect the recess to the outside of the heat plate. A gas supplied through the duct is heated by a heater and discharged into the recess.
Claims7
A wire bonding method by which a second semiconductor chip is connected with at least one second wire to a second main surface of a lead frame, with a first main surface thereof having been connected to a first semiconductor chip with at least one first wire, comprising:
- providing said lead frame on a mounting base such that said first semiconductor chip and wire are received by a recess of said mounting base without said first wire coming into contact with said recess;
- and
- supplying said recess with a gas through a duct to heat said second semiconductor chip.
A wire bonding method, comprising the steps of:
- placing a lead frame on a mounting base so that a first surface of the lead frame faces downward, said lead frame being placed on the mounting base so that a first semiconductor chip mounted on the first surface and a first wire connected to the first semiconductor chip are accommodated in a recess formed in the mounting base;
- supplying a gas into the recess through a duct for heating a second semiconductor chip mounted on a second surface of the lead frame opposite to the second surface;
- and
- bonding a wire to the second semiconductor chip.
Dependencies are inferred from the claim text.