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US 2009/0289033 A1Published application
Polishing composition containing polyether amine
AssigneeCabot Microelectronics Corporation
InventorsJeffrey M. Dysard, Paul M. Feeney, Sriram P. Anjur, Timothy P. Johns, Yun-Biao Xin, Li Wang
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Abstract
The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.
Claims23
A method of chemically-mechanically polishing a substrate, which method comprises:
- (i) contacting a substrate with a chemical-mechanical polishing composition comprising:
- (a) an abrasive,
- (b) a liquid carrier, and
- (c) a compound selected from the group consisting of
- (1) a compound of the Formula (I)
- wherein x=2-6,
- (2) a compound of the Formula (II)
- wherein x+z=2-4 and y=1-50, and
- (3) combinations thereof,
- (ii) moving the polishing component relative to the substrate, and
- (iii) abrading at least a portion of the substrate to polish the substrate.
8 more elements
A method of chemically-mechanically polishing a substrate, which method comprises:
- (i) contacting a substrate comprising at least one layer of polysilicon with a chemical-mechanical polishing composition comprising:
- (a) an abrasive,
- (b) a liquid carrier, and
- (c) a compound selected from the group consisting of
- (1) 4,7,10-trioxamidecane-1,13-diamine,
- (2) a compound of the Formula (I)
- wherein x=2-6,
- (3) a compound of the Formula (II)
- wherein x+z=2-4 and y=1-50, and
- (4) combinations thereof,
- (ii) moving the polishing component relative to the substrate, and
- (iii) abrading at least a portion of the substrate to polish the substrate.
9 more elements
Dependencies are inferred from the claim text.