Partial plating method, a laser plating device, and a plated material
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorKoukichi Haga
Life of this patent
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Abstract
A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating.
Claims19
A partial plating method comprising plating a region to be plated of a member to be plated which is in contact with a plating solution by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less onto the region to be plated.
A laser plating device comprising:
- plating solution contact means for bringing a region to be plated of a member to be plated having a positioning hole for positioning of the region to be plated of the member to be plated into contact with a plating solution;
- laser oscillation means for emitting a laser beam which is projected onto the region to be plated of the member to be plated which is in contact with the plating solution so that a plating metal is deposited on the member to be plated;
- conveying means of the member to be plated for conveying the member to be plated so that the member to be plated passes through the plating solution contact means;
- position detecting means for detecting that the positioning hole of the member to be plated being conveyed by the conveying means of the member to be plated is placed in a predetermined position;
- and
- laser beam scanning means, including a movable mirror which is arranged on an optical path of the laser beam and is capable of scanning the laser beam, for having the laser beam scan and follow the same region to be plated of the member to be plated being conveyed in the plating solution and returning the laser beam to a position where the scanning and the following are started when the position detecting means detects that the positioning hole is placed in the predetermined position.
A laser plating device comprising:
- plating solution contact means for bringing a member to be plated into contact with a plating solution;
- intermittent conveying means of the member to be plated for performing intermittent conveyance of the member to be plated by repeating conveyance and halt of the member to be plated in order to pass the member to be plated through the plating solution contact means;
- laser oscillation means for emitting a laser beam which is projected onto the member to be plated which is in contact with the plating solution during the halt so that a plating metal is deposited on the member to be plated;
- and
- positioning means, including an ascent/descent pin which moves in ascent/descent motion and a shaft thereof is fixed to a position having a fixed positional relation with a projection position of the laser beam emitted by the laser oscillation means, for performing positioning of the laser beam projection position by the laser oscillation means onto the member to be plated.
A plated member comprising a region to be plated on which a partial plating is formed by bringing the region to be plated into contact with a plating solution and projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less onto the region to be plated so that a plating metal is deposited on the region irradiated with the laser beam.
Dependencies are inferred from the claim text.