Wiring board and method of manufacturing the same

A method of manufacturing a wiring board, the method comprising:

• (a) forming a through-hole in a resin substrate, wherein a metal foil is formed on both surfaces of the resin substrate;
• (b) forming a first power feeding layer on the metal foil and an inner surface of the through-hole;
• (c) forming a first plating mask on the first power feeding layer;
• (d) forming a first plated layer on the first power feeding layer by using the first plating mask;
• (e) removing the first plating mask;
• (f) removing portions of the first power feeding layer and the metal foil that are exposed from the first plated layer, thereby forming a first wiring layer;
• (g) covering surfaces of the resin substrate and the first wiring layer with a resin member while filling an inner space of the through-hole with the resin member;
• (h) grinding the resin member such that the surface of the first wiring layer is flush with a surface of the resin member;
• (i) forming a second power feeding layer on the surfaces of the first wiring layer and the resin member;
• (j) forming a second plating mask on the second power feeding layer;
• (k) forming a second plated layer on the second power feeding layer by using the second plating mask;
• (l) removing the second plating mask;
• and
• (m) removing a portion of the second power feeding layer that is exposed from the second plating mask, thereby forming a second wiring layer.