Printed circuit board including outmost fine circuit pattern and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHan Kim, Mi Sun Hwang, Suk Won Lee, Chang Gun Oh
Life of this patent
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Abstract
Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed.
Claims12
A printed circuit board including an outmost fine circuit pattern layer, comprising:
- a first insulating layer;
- a first circuit layer including a first circuit pattern, formed on a surface of the first insulating layer;
- a second circuit layer including a first lower land, formed on the other surface of the first insulating layer;
- a first via for electrical connection between the first circuit pattern and the first lower land;
- a second insulating layer;
- a third circuit layer including a second circuit pattern, formed on a surface of the second insulating layer;
- a fourth circuit layer including a second lower land, formed on the other surface of the second insulating layer;
- a second via for electrical connection between the second circuit pattern and the second lower land;
- a third insulating layer disposed between the second circuit layer and the fourth circuit layer;
- and
- a conductive bump for electrical connection between the first lower land and the second lower land;
- wherein the first via is configured such that a diameter of the first via is reduced toward the first circuit pattern from the first lower land, while the second via is configured such that a diameter of the second via is reduced toward the second circuit pattern from the second lower land.
A method of manufacturing a printed circuit board including an outmost fine circuit pattern layer, the method comprising:
- preparing a first double-sided substrate including a first insulating layer, a first lower copper layer formed on a surface of the first insulating layer, a second circuit layer including a first lower land, formed on the other surface of the first insulating layer, and a first via which is reduced in diameter toward the first lower copper layer from the first lower land for interlayer connection;
- preparing a second double-sided substrate including a second insulating layer, a third lower copper layer formed on a surface of the second insulating layer, a fourth circuit layer including a second lower land, formed on the other surface of the second insulating layer, and a second via which is reduced in diameter toward the third lower copper layer from the second lower land for interlayer connection;
- disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump;
- and
- forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer.
Dependencies are inferred from the claim text.