Curvilinear wiring structure to reduce areas of high field density in an integrated circuit
AssigneeInternational Business Machines Corporation
InventorsFelix P. Anderson, Thomas L. McDevitt, Anthony K. Stamper
Life of this patent
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Abstract
A method for reducing areas of high field density in an integrated circuit is disclosed. In one embodiment, the method includes forming a first curvilinear wiring structure in a first interconnect layer of an integrated circuit. A second curvilinear wiring structure may be formed in a second interconnect layer of the integrated circuit, such that the first and second curvilinear wiring structures are substantially vertically aligned. The first curvilinear wiring structure may then be electrically connected to the second curvilinear wiring structure.
Claims18
A method for reducing areas of high field density in an integrated circuit, the method comprising:
- forming a first curvilinear wiring structure in a first interconnect layer of an integrated circuit;
- forming a second curvilinear wiring structure in a second interconnect layer of the integrated circuit, wherein the second curvilinear wiring structure is substantially vertically aligned with the first curvilinear wiring structure;
- and
- electrically connecting the first curvilinear wiring structure to the second curvilinear wiring structure.
An apparatus for reducing areas of high field density in an integrated circuit, the apparatus comprising:
- a first curvilinear wiring structure in a first interconnect layer of an integrated circuit;
- a second curvilinear wiring structure in a second interconnect layer of the integrated circuit, wherein the second curvilinear wiring structure is substantially vertically aligned with the first curvilinear wiring structure;
- and
- an electrical connection between the first curvilinear wiring structure and the second curvilinear wiring structure.
The apparatus of claim 11, wherein the electrical connection comprises a curvilinear conductive via extending between the first curvilinear wiring structure and the second curvilinear wiring structure.
The apparatus of claim 12, wherein the first curvilinear wiring structure comprises a first set of concentric conductive annular structures having a first electrode and a second electrode.
The apparatus of claim 13, wherein the second curvilinear wiring structure comprises a second set of concentric conductive annular structures having a first electrode and a second electrode.
The apparatus of claim 14, wherein a first curvilinear conductive via connects the first electrode of the first set to the first electrode of the second set, and a second curvilinear conductive via connects the second electrode of the first set to the second electrode of the second set.
The apparatus of claim 15, wherein the first curvilinear conductive via is substantially adjacent to the second curvilinear conductive via along a radius of at least one of the first and second sets of concentric conductive annular structures.
The apparatus of claim 15, wherein the first curvilinear conductive via is substantially adjacent and radially offset from the second curvilinear conductive via.
A design structure embodied in a machine-readable medium, the design structure comprising:
- a first curvilinear wiring structure in a first interconnect layer of an integrated circuit;
- a second curvilinear wiring structure in a second interconnect layer of the integrated circuit, wherein the second curvilinear wiring structure is substantially vertically aligned with the first curvilinear wiring structure;
- and
- an electrical connection between the first curvilinear wiring structure and the second curvilinear wiring structure.
The design structure of claim 19, wherein the electrical connection comprises a curvilinear conductive via extending between the first curvilinear wiring structure and the second curvilinear wiring structure, the curvilinear conductive via having a cross-sectional shape substantially conforming to a curvilinear shape of at least one of the first and second curvilinear wiring structures.
Dependencies are inferred from the claim text.