Di-cinnamyl compounds and methods for use thereof
AssigneeDesigner Molecules, Inc.
InventorStephen M. Dershem
Life of this patent
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Abstract
The invention generally relates to di-cinnamyl compounds useful in a variety of adhesive applications. More specifically, the invention provides chain-extended bismaleimides and methods for generating them by reaction with di-cinnamyl compounds, including particular di-cinnamyl compounds disclosed herein. Invention di-cinnamyl compounds can also be used as co-monomers in a Diels-Alder type cure, and can act as a co-monomer in a thermoset composition with a maleimide monomer.
Claims20
A method for preparing a chain-extended a bismaleimide comprising:
- a) mixing a molar excess of at least one bismaleimide with at least one di-cinnamyl compound;
- and
- b) heating the mixture of step (a), thereby preparing a chain-extended bismaleimide.
A method for reducing the brittleness of a cured bismaleimide thermoset, comprising:
- (a) mixing a molar excess of at least one bismaleimide with at least one di-cinnamyl compound, thereby producing a bismaleimide thermoset mixture;
- (b) heating the bismaleimide thermoset mixture of step (a), thereby chain-extending the bismaleimide in the bismaleimide thermoset mixture;
- and
- (c) curing the chain-extended bismaleimide thermoset mixture, thereby reducing the brittleness of the cured bismaleimide thermoset.
A method for increasing the adhesion of a cured bismaleimide thermoset comprising:
- (a) mixing a molar excess of at least one bismaleimide with at least one di-cinnamyl compound thereby producing a bismaleimide thermoset mixture;
- (b) heating the mixture of step (a), thereby chain-extending the bismaleimide in the bismaleimide thermoset mixture thermoset mixture;
- and
- (c) curing the chain-extended bismaleimide thermoset mixture, thereby reducing the brittleness of the cured bismaleimide thermoset.
Dependencies are inferred from the claim text.