Electrode and Vacuum Processing Apparatus

Abstract

An electrode and a vacuum processing apparatus are provided that are capable of improving the film deposition rate and the uniformity of the distribution of the deposited film. The electrode includes a plurality of electrodes (17A, 17B) extending from positions arranged at a predetermined interval along a surface of a substrate to be processed (3). Buffer chambers (25) each extend along and between two of the plurality of electrodes (17A, 17B). A plurality of first gas injection holes (27) are arranged in the direction in which the electrodes (17A, 17B) extend and which supply a reactant gas into the buffer chamber (25). A second gas injection hole (23) has a slit form extending in the direction in which the electrodes (17A, 17B) extend, and which supplies the reactant gas from the buffer chamber (25) toward the substrate to be processed (3).

Dependencies are inferred from the claim text.