Integrated mechanical package design for combi sensor apparatus

An integrated combi sensor apparatus, comprising:

• a pressure sensor and a signal conditioner mounted in a first compartment of a housing associated with at least one lead frame of a combi sensor module;
• a temperature sensor mounted in a second compartment and a humidity sensor in a third compartment associated with said housing;
• and
• at least one sensing element associated with said pressure sensor, said temperature sensor and said humidity sensor, said at least one sensing element electrically coupled to said signal conditioner in order to condition an output signal and generate a conditioned output thereof in order to permit said combi sensor module to measure environmental parameters with a high accuracy and a faster response time.

An integrated combi sensor apparatus, comprising:

• a pressure sensor and a signal conditioner mounted in a first compartment of a housing associated with at least one lead frame of a combi sensor module, wherein said pressure sensor is maintained by a conformal coating a pressure cover;
• a temperature sensor mounted in a second compartment and a humidity sensor in a third compartment associated with said housing;
• at least one sensing element associated with said pressure sensor, said temperature sensor and said humidity sensor, said at least one sensing element electrically coupled to said signal conditioner in order to condition an output signal and generate a conditioned output thereof in order to permit said combi sensor module to measure environmental parameters with a high accuracy and a faster response time;
• and
• a hydrophobic cover, wherein said humidity cover and said hydrophobic cover are attached to said humidity sensor, wherein said hydrophobic filter prevents moisture-saturated air from reaching a sensing element thereof.