Metal core package substrate and method for manufacturing the same

A method for manufacturing a metal core package substrate, comprising:

• forming a plurality of holes in a metal core;
• forming a plurality of paste bumps piercing into an insulation layer on a first copper foil layer;
• forming the insulation layer on a second copper foil layer;
• positioning the first copper foil layer so that the paste bumps are positioned at positions corresponding to the holes of the metal core on the metal core and positioning the insulation layer of the second copper foil layer to face the metal core;
• allowing each paste bump to pierce into the holes of the metal core by pressing the first copper foil layer and the second copper foil layer;
• and
• forming inner circuits in the metal core pierced with the paste bumps.

A metal core package substrate, comprising:

• a metal core layer including a plurality of holes penetrating a body;
• a paste bump penetrating the holes;
• first and second insulating layers exposing both end portions of the paste bump and disposed on both surface of the metal core layer;
• and
• circuits disposed on outer surfaces of the first and second insulating layers, and electrically connected to each other.