# US 2009/0267084 A1 · Integrated circuit with wireless connection > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0267084 A1 - Document ID: US20090267084A1 - Status: Published application - Kind: A1 - Application number: 12/109,558 - Filed: 2008-04-25 - Published: 2009-10-29 - Earliest claimed: 2008-04-25 - Assignees: Qimonda AG - Inventors: Christoph Bilger; Peter Gregorius; Michael Bruennert; Maurizio Skerlj; Wolfgang Walthes; Johannes Stecker; Hermann Ruckerbauer; Dirk Scheideler; Roland Barth - Web page: https://patentgrep.com/patent/US20090267084A1 ## CPC - H10W 72/00: Interconnections or connectors in packages - H10W 90/00: Package configurations - H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling} - H10W 72/01: {Manufacture or treatment} - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/90: Bond pads, in general - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 90/732: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An integrated circuit includes a device stack including: a memory device with a first wireless coupling element, and a semiconductor device with a second wireless coupling element. The first and second wireless coupling elements are arranged face-to-face and are configured to provide a wireless connection between the memory device and the semiconductor device. ## Claims ### Claim 1 An integrated circuit, comprising: a device stack including: a memory device comprising a first wireless coupling element; and a semiconductor device including a second wireless coupling element; wherein the first and second wireless coupling elements are arranged face-to-face and are configured to provide a wireless connection between the memory device and the semiconductor device. ### Claim 2 (depends on 1) The integrated circuit according to claim 1, wherein the first and second wireless coupling elements comprise capacitor plates. ### Claim 3 (depends on 2) The integrated circuit according to claim 2, wherein the first and second capacitor plates arranged in an outermost conductive layer of the memory device and the semiconductor device, respectively. ### Claim 4 (depends on 1) The integrated circuit according to claim 1, wherein the first and second wireless coupling elements comprise coils. ### Claim 5 (depends on 4) The integrated circuit according to claim 4, wherein the first and second coils are formed in an outermost conductive layer of the memory device and the semiconductor device, respectively. ### Claim 6 (depends on 1) The integrated circuit according to claim 1, wherein one of the first and second wireless coupling elements is a light emitting element and the other one of the first and second wireless coupling elements is a light receiving element. ### Claim 7 (depends on 6) The integrated circuit according to claim 6, wherein: the memory device further comprises a third wireless coupling element; and the semiconductor device further comprises a fourth wireless coupling element arranged face-to-face with the third wireless coupling element with a dielectric layer sandwiched there between, the third wireless coupling element being of a same type as the second wireless coupling element and the fourth wireless coupling element being of the same type as the first wireless coupling element. ### Claim 8 (depends on 1) The integrated circuit according to claim 1, wherein the semiconductor device is a memory device. ### Claim 9 (depends on 1) The integrated circuit according to claim 1, wherein the semiconductor device is one of: a central processing unit, a memory controller and a memory buffer. ### Claim 10 (depends on 1) The integrated circuit according to claim 1, wherein the memory device and the semiconductor device comprise wired connections for electric power supply. ### Claim 11 (depends on 10) The integrated circuit according to claim 10, wherein the wired connections are at least one of: bond wires, solder balls and through-hole vias. ### Claim 12 (depends on 1) The integrated circuit according to claim 1, further comprising: at least one further memory device including a third wireless coupling element; wherein: the semiconductor device further comprises a fourth wireless coupling element; and the third and fourth wireless coupling elements are arranged face-to-face and are configured to provide a further wireless connection between the memory device and the semiconductor device. ### Claim 13 (depends on 1) The integrated circuit according to claim 1, further comprising: a further memory device stacked on the memory device and including a third wireless coupling element; wherein: the memory device wirelessly connected to the semiconductor device further comprises a fourth wireless coupling element; and the third and fourth wireless coupling elements are arranged face-to-face and are configured to provide a further wireless connection between the memory device wirelessly connected to the semiconductor device and the further memory device. ### Claim 14 (depends on 1) The integrated circuit according to claim 1, wherein the wireless connection is provided by at least one of: capacitive coupling, inductive coupling and optical coupling. ### Claim 15 (depends on 1) The integrated circuit according to claim 1, further comprising: a dielectric arranged between the first wireless coupling element and the second wireless coupling element. ### Claim 16 A method for transferring data between a memory device and a semiconductor device, the method comprising: transferring data signals between the memory device and the semiconductor device via a wireless connection. ### Claim 17 (depends on 16) The method of claim 16, wherein the wireless connection is provided by at least one of: capacitive coupling, inductive coupling and optical coupling. ### Claim 18 A method for manufacturing an integrated circuit, the method comprising: providing a memory device including a first wireless coupling element; providing a semiconductor device including a second wireless coupling element; and stacking the memory device and the semiconductor device such that the first wireless coupling element is arranged face-to-face with the second wireless coupling element. ### Claim 19 (depends on 18) The method according to claim 18, wherein the first and second wireless coupling elements are formed as capacitor plates. ### Claim 20 (depends on 18) The method according to claim 18, wherein the first and second wireless coupling elements are formed as coils. ### Claim 21 (depends on 18) The method according to claim 18, wherein one of the first and second wireless coupling elements is a light emitting element and the other one of the first and second wireless coupling elements is a light receiving element. ### Claim 22 (depends on 18) The method according to claim 18, wherein a dielectric is sandwiched between the memory device and the semiconductor device ### Claim 23 A computer system, comprising: an integrated circuit, including: a device stack comprising: a memory device with a first wireless coupling element and a semiconductor device with a second wireless coupling element; and a dielectric arranged between the first and second wireless coupling elements, wherein the first and second wireless coupling elements are arranged face-to-face and are configured to provide a wireless connection between the memory device and the semiconductor device.