# US 2009/0266705 A1 · Method of manufacturing vertical magnetic head > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0266705 A1 - Document ID: US20090266705A1 - Status: Published application - Kind: A1 - Application number: 12/333,075 - Filed: 2008-12-11 - Published: 2009-10-29 - Earliest claimed: 2008-04-28 - Assignees: Fujitsu Limited - Inventors: Kentaro Suzuki; Kazuaki Satoh - Web page: https://patentgrep.com/patent/US20090266705A1 ## CPC - G11B 5/3116: {Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks (G11B5/3113, G11B5/245 take precedence)} - G11B 5/1278: {specially adapted for magnetisations perpendicular to the surface of the record carrier} - G11B 5/3163: {Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers} - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) ## Abstract The method of manufacturing a vertical magnetic head comprises the steps of: forming a resist pattern including a concave section on a wafer substrate; laminating a plurality of films in the concave section until forming a prescribed multilayer structure of the main magnetic pole; and removing the resist pattern. Inner faces of the concave section are perpendicular to a surface of the wafer substrate. The laminating step includes the sub-steps of: (a) performing a sputtering process, in which particles are perpendicularly sputtered with respect to the surface of the wafer substrate, a plurality of times so as to laminate a plurality of sputtered films in the concave section; and (b) removing the sputtered films, which have been stuck on the resist pattern in the sub-step (a), from the resist pattern. The sub-steps (a) and (b) are repeated until the prescribed multilayer structure is formed. ## Claims ### Claim 1 A method of manufacturing a vertical magnetic head, comprising the steps of: forming a resist pattern including a concave section, whose planar shape corresponds to that of a main magnetic pole to be formed, on a wafer substrate; laminating a plurality of films in the concave section until forming a prescribed multilayer structure of the main magnetic pole; and removing the resist pattern after laminating the films, wherein inner faces of the concave section are perpendicular to a surface of the wafer substrate in said forming step, said laminating step includes the sub-steps of: (a) performing a sputtering process, in which particles are perpendicularly sputtered with respect to the surface of the wafer substrate, a prescribed number of times so as to flatly laminate the sputtered films in the concave section; and (b) removing the sputtered films, which have been stuck on a surface of the resist pattern in the sub-step (a), from the surface of the resist pattern by an abrasive process, and the sub-steps (a) and (b) are repeated, in said laminating step, until the prescribed multilayer structure is formed. ### Claim 2 (depends on 1) The method according to claim 1, wherein a cross-section of a pole end part of the main magnetic pole is formed into an inverted trapezoidal shape, by an ion trimming process, after said removing step. ### Claim 3 (depends on 1) The method according to claim 1, wherein the sub-step (a) is performed by a point-cusp magnetic field sputtering apparatus. ### Claim 4 (depends on 2) The method according to claim 2, wherein the sub-step (a) is performed by a point-cusp magnetic field sputtering apparatus. ### Claim 5 (depends on 1) The method according to claim 1, wherein a position of exposing the surface of the resist pattern is detected as a terminal point of the abrasive process of the sub-step (b). ### Claim 6 (depends on 2) The method according to claim 2, wherein a position of exposing the surface of the resist pattern is detected as a terminal point of the abrasive process of the sub-step (b). ### Claim 7 (depends on 3) The method according to claim 3, wherein a position of exposing the surface of the resist pattern is detected as a terminal point of the abrasive process of the sub-step (b). ### Claim 8 (depends on 4) The method according to claim 4, wherein a position of exposing the surface of the resist pattern is detected as a terminal point of the abrasive process of the sub-step (b). ### Claim 9 (depends on 1) The method according to claim 1, wherein a stopper film is formed on the surface of the resist pattern after said forming step, and the stopper film is used as a stopper of the abrasive process of the sub-step (b). ### Claim 10 (depends on 2) The method according to claim 2, wherein a stopper film is formed on the surface of the resist pattern after said forming step, and the stopper film is used as a stopper of the abrasive process of the sub-step (b). ### Claim 11 (depends on 3) The method according to claim 3 wherein a stopper film is formed on the surface of the resist pattern after said forming step, and the stopper film is used as a stopper of the abrasive process of the sub-step (b). ### Claim 12 (depends on 4) The method according to claim 4, wherein a stopper film is formed on the surface of the resist pattern after said forming step, and the stopper film is used as a stopper of the abrasive process of the sub-step (b).