# US 2009/0266584 A1 · Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipiating wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0266584 A1 - Document ID: US20090266584A1 - Status: Published application - Kind: A1 - Application number: 12/065,915 - Filed: 2006-09-25 - Published: 2009-10-29 - Earliest claimed: 2005-09-27 - Assignees: Matsushita Electric Industrial Co., Ltd. - Inventors: Tetsuya Tsumura; Hiroharu Nishiyama; Etsuo Tsujimoto - Web page: https://patentgrep.com/patent/US20090266584A1 ## CPC - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H10H 20/8585: {being an interconnection} - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H05K 3/202: {using self-supporting metal foil pattern} - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses - H05K 2201/10106: Light emitting diode [LED] - H10H 20/8582: {characterised by their shape} - H10W 70/6875: {being on a metallic substrate, e.g. insulated metal substrates [IMS]} - H10W 70/695: Organic materials - Y10T 29/49128: Assembling formed circuit to base - Y10T 29/49162: by using wire as conductive path - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible. ## Claims ### Claim 1 A heat radiating wiring board, comprising: at least one circuit pattern constituted of a metal wiring plate; a resin plate having insulating properties into which filler is mixed; and a heat sink, wherein: the at least one circuit pattern is attached to one surface side of the resin plate; the heat sink is attached to the other surface side of the resin plate; and a thickness of a part of the at least one circuit pattern is less than the thickness of a portion other than the part. ### Claim 2 A heat radiating wiring board, comprising: at least one circuit pattern constituted of a metal wiring plate; a resin plate having insulating properties into which filler is mixed; and a heat sink, wherein: the at least one circuit pattern is embedded in the resin plate; the heat sink is attached to the resin plate while being non conducting with the at least one circuit pattern; and a thickness of a part of the at least one circuit pattern is less than the thickness of a portion other than the part. ### Claim 3 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein the metal wiring plate constituting the at least one circuit pattern is one made by processing a conductive metal plate having a thickness 0.05 mm or more and 2.0 mm or less to be thin. ### Claim 4 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein the metal wiring plate constituting the at least one circuit pattern having two or more different thicknesses in a same plate. ### Claim 5 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein: the at least one circuit pattern includes a plurality of circuit patterns disposed adjacent to each other; the plurality of circuit patterns are disposed such that thin portions of the plurality of circuit patterns face each other; and thicknesses of the thin portions are different from each other. ### Claim 6 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein: the at least one circuit pattern includes a plurality of circuit patterns disposed adjacent to each other; the plurality of circuit patterns are disposed such that thin portions of the plurality of circuit patterns face each other; and areas of top surfaces of the plurality of circuit patterns constituting the thin portions are different from each other. ### Claim 7 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein: the at least one circuit pattern includes a plurality of circuit patterns disposed adjacent to each other; and the plurality of circuit patterns are disposed such that a thin portion of any one of the plurality of circuit patterns face a thick portion of an other one of the plurality of circuit patterns. ### Claim 8 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein a surface connecting from a thin portion to a thick portion, the surface constituting a side surface of the at least one circuit pattern, is an inclined surface. ### Claim 9 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein a surface connecting from a thin portion to a thick portion, the surface constituting a side surface of the at least one circuit pattern, is a curved surface. ### Claim 10 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein an area of a top surface of the at least one circuit pattern constituting a thick portion is larger than the area of a top surface of the at least one circuit pattern constituting a thin portion. ### Claim 11 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein a part of the at least one circuit pattern protrudes from the resin plate and constitutes a heat radiation portion. ### Claim 12 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein a part of the at least one circuit pattern protruding from the resin plate constitutes a terminal. ### Claim 13 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein a part of the at least one circuit pattern protruding from the resin plate constitutes a heat radiation fin. ### Claim 14 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein heat radiation fin is attached to a part of the at least one circuit pattern protruding from the resin plate. ### Claim 15 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein the heat radiating wiring board has a configuration of floating from a mother board with a part of the at least one circuit pattern protruding from the resin plate as a pillar. ### Claim 16 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein the resin plate is a composite resin plate in which at least one or more kinds of filler among Al2O3, MgO, SiO2, BN, AlN, SiC, and ZnO filler are contained in resin having epoxy as a base compound. ### Claim 17 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein: the resin plate is a composite resin plate in which at least one or more kinds of filler among Al2O3, MgO, SiO2, BN, AlN, SiC, and ZnO filler are contained in resin having epoxy as a base compound; and an amount of the filler added is 70 percent by weight or more and 95 percent by weight or less. ### Claim 18 (depends on 1, 2) The heat radiating wiring board according to claim 1 or 2, wherein the metal wiring plate is tough pitch copper. ### Claim 19 (depends on 1, 2) An electrical apparatus comprising the heat radiating wiring board according to claim 1 or 2, wherein an element is mounted on a thick portion of the at least one circuit pattern, the element having heat generating properties higher than the heat generating properties of an element mounted on a thin portion of the at least one circuit pattern. ### Claim 20 (depends on 1, 2) An electrical apparatus comprising the heat radiating wiring board according to claim 1 or 2, wherein: at least any one of a laser element, an LED, a power transistor, a power choke coil, and a power semiconductor is mounted on a thick portion of the at least one circuit pattern; and at least any one of a control IC, a signal IC, a diode, and a minute LED is mounted on a thin portion of the at least one circuit pattern. ### Claim 21 A method for manufacturing a heat radiating wiring board, comprising a step of heating a metal wiring plate partially having different thicknesses by using a press and resin to which filler is added, so that the metal wiring plate is integrated. ### Claim 22 (depends on 21) The method for manufacturing a heat radiating wiring board according to claim 21, wherein the metal wiring plate constituting at least one circuit pattern is formed to have different thicknesses in a rolling process by a roller. ### Claim 23 (depends on 21) The method for manufacturing a heat radiating wiring board according to claim 21, wherein part of the metal wiring plate is thinned by any one method of press working, metal molding, etching, laser machining, cutting, and electrical discharge machining. ### Claim 24 (depends on 21) The method for manufacturing a heat radiating wiring board according to claim 21, wherein a thin part of the metal wiring plate is cut out using a press or a metal mold to form a fine pattern. ### Claim 25 (depends on 21) The method for manufacturing a heat radiating wiring board according to claim 21, wherein etching, laser machining, or wire electrical discharge machining is applied to a thin part of the metal wiring plate to form a wiring circuit.