Methods and apparatuses for determining thickness of a conductive layer
AssigneeNovellus Systems, Inc.
InventorsSudeep Kumar Lahiri, Paul Franzen
Life of this patent
Estimating the term…
Loading patent…
AssigneeNovellus Systems, Inc.
InventorsSudeep Kumar Lahiri, Paul Franzen
Estimating the term…
Methods and apparatuses are provided for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. Such curves can reduce the number of wafers used in the calibration of the sensors while providing higher accuracy over a larger thickness range. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.
A method of processing a wafer, the method comprising:
A method of determining a thickness of a conductive layer on a workpiece, the method comprising:
A method of calibrating an eddy current sensor, the method comprising:
A method of determining a thickness of a conductive layer on a workpiece, the method comprising:
An apparatus for determining thickness, the apparatus comprising:
Dependencies are inferred from the claim text.