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US 2009/0263143 A1Published application
Optical communication integration
AssigneeFreescale Semiconductor, Inc.
InventorsPerry H. Pelley, Dennis C. Hartman
Life of this patent
Estimating the term…
Abstract
An integrated circuit die has a transistor circuitry section for implementing information handling operations. Optical circuitry is within the single semiconductor die. The optical circuitry includes a laser transmitter and is operably coupled to the transistor circuitry section. The transistor circuitry section originates information. The optical circuitry transmits the information in a laser beam through a wave guide to the edge of the integrated circuit die.
Claims21
An apparatus comprising:
- a transistor circuitry section for implementing information handling operations, the transistor circuitry section located within a single semiconductor die;
- and
- optical circuitry within the single semiconductor die and comprising a laser transmitter, the transistor circuitry section for originating information and the optical circuitry for optically transmitting the information through a plane generally parallel to a major side of the single semiconductor die.
A method comprising:
- providing a laser diode of a laser in a first wafer;
- providing a second wafer, the second wafer including a semiconductor layer portion;
- bonding the first wafer and the second wafer together at an interface to form a composite wafer including the semiconductor layer portion and the laser diode;
- forming a wave guide from the semiconductor layer portion, the wave guide for carrying photons generated by the laser diode;
- forming a transistor on the composite wafer, the transistor including a channel region at least partially located in the semiconductor layer portion.
2 more elements
A method comprising:
- providing a transistor circuitry section within a single semiconductor die, the transistor circuitry section including transistors having at least a portion of a channel region in a layer of semiconductor material, the transistor circuitry section including circuitry for implementing information handling operations;
- and
- providing an optical section within the single semiconductor die, the optical section comprising a laser diode, a laser cavity in proximity to the laser diode to receive photons from the laser diode, and a wave guide extending laterally from the laser cavity for optically transmitting an information signal, wherein the wave guide is formed from the layer of semiconductor material.
Dependencies are inferred from the claim text.