# US 2009/0261084 A1 · Laser Dicing Sheet and Manufacturing Method For Chip Body

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- Number: US 2009/0261084 A1
- Document ID: US20090261084A1
- Status: Published application
- Kind: A1
- Application number: 11/871,154
- Filed: 2007-10-11
- Published: 2009-10-22
- Earliest claimed: 2006-12-05
- Assignees: Lintec Corporation
- Inventors: Yoji Wakayama; Yosuke Sato; Naoki Taya
- Web page: https://patentgrep.com/patent/US20090261084A1

## CPC

- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- B23K 26/18: using absorbing layers on the workpiece, e.g. for marking or protecting purposes
- B23K 26/40: taking account of the properties of the material involved
- C09J 7/25: based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- B23K 2103/50: {Inorganic materials other than metals or composite materials}
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/414: presence of a copolymer
- C09J 2433/00: Presence of (meth)acrylic polymer
- C09J 2433/006: in the substrate
- C09J 2475/006: in the substrate
- H10P 72/7416: {used during dicing or grinding}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)

## Abstract

An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.

## Claims

### Claim 1

A laser dicing sheet comprising:
a base material comprising a polyurethane acrylate; and
an adhesive layer formed on one face thereof.

### Claim 2 (depends on 1)

The laser dicing sheet as set forth in claim 1, wherein the polyurethane acrylate which constitutes the base material is a cured product obtained by irradiating energy beam to a mixture including an energy beam curable urethane acrylate oligomer and an energy beam curable monomer.

### Claim 3 (depends on 2)

The laser dicing sheet as set forth in claim 2, wherein the energy beam curable urethane acrylate oligomer is a polyether type urethane acrylate oligomer.

### Claim 4 (depends on 3)

The laser dicing sheet as set forth in claim 3, wherein an ether bonding portion of the polyether type urethane acrylate oligomer is an alkylene oxy group (—(—R—O—)n—: wherein R is alkylene group, n is an integer of 2 to 200).

### Claim 5 (depends on 4)

The laser dicing sheet as set forth in claim 4, wherein the alkylene group R of the alkylene oxy group (—(—R—O—)n—) is alkylene group having 1 to 6 carbon atoms.

### Claim 6 (depends on 5)

The laser dicing sheet as set forth in claim 5, wherein the alkylene group R of the alkylene oxy group (—(—R—O—)n—) is ethylene, propylene, butylene or tetramethylene.

### Claim 7 (depends on 1, 2, 3, 4, 5, 6)

Method for manufacturing a chip body comprising steps of;
adhering a work on the adhesive layer of the laser dicing sheet as set forth in any one of claims 1 to 6;
dicing the work into individual chips by laser beam.