# US 2009/0260872 A1 · Module for packaging electronic components by using a cap > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0260872 A1 - Document ID: US20090260872A1 - Status: Published application - Kind: A1 - Application number: 12/422,477 - Filed: 2009-04-13 - Published: 2009-10-22 - Earliest claimed: 2008-04-21 - Assignees: Advanced Semiconductor Engineering, Inc. - Inventors: Jian Cheng CHEN - Web page: https://patentgrep.com/patent/US20090260872A1 ## CPC - H05K 9/0026: {integrally formed from metal sheet} - H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49002: Electrical device making - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A module for packaging electronic components includes a carrier, at least one electronic component and a cap. The carrier has a first region and a second region. The electronic component is disposed on the first region of the carrier. The cap is mounted on the second region, and includes an inner layer and an outer layer, wherein the inner layer is made of a non-conductive material, the outer layer is made of a conductive material, and the inner layer made of the non-conductive material covers the electronic components and the whole first region. ## Claims ### Claim 1 A module for packaging electronic components comprising: a carrier having a first region and a second region; at least one electronic component disposed on the first region; and a cap mounted on the second region and comprising an inner layer and an outer layer, wherein the inner layer is made of a non-conductive material, the outer layer is made of a conductive material, the inner layer made of the non-conductive material covers the electronic components and the whole first region, and the inner layer contacts one of the electronic components. ### Claim 2 (depends on 1) The module as claimed in claim 1, wherein the one of the electronic components has a height being the highest in the module. ### Claim 3 (depends on 1) The module as claimed in claim 1, wherein the conductive material is a metallic material. ### Claim 4 (depends on 3) The module as claimed in claim 3, wherein the metallic material is one of copper and iron. ### Claim 5 (depends on 1) The module as claimed in claim 1, wherein the non-conductive material is a non-metallic material. ### Claim 6 (depends on 5) The module as claimed in claim 5, wherein the non-metallic material is one of plastics and rubber. ### Claim 7 (depends on 1) The module as claimed in claim 1, wherein the inner layer is a base layer, and the outer layer is a coating layer. ### Claim 8 (depends on 1) The module as claimed in claim 1, wherein the inner layer is a coating layer, and the outer layer is a base layer. ### Claim 9 (depends on 7) The module as claimed in claim 7, wherein the thickness of the base layer is larger than that of the coating layer. ### Claim 10 (depends on 1) The module as claimed in claim 1, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion. ### Claim 11 (depends on 1) The module as claimed in claim 1, wherein the electronic components include an active component. ### Claim 12 (depends on 1) The module as claimed in claim 1, wherein the electronic components include a passive component. ### Claim 13 (depends on 1) The module as claimed in claim 1, wherein the module is a module for packaging wireless communication components. ### Claim 14 A cap comprising: an inner layer; and an outer layer disposed on a surface of the inner layer so as to form a cap, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion, the inner layer is made of a non-conductive material, and the outer layer is made of a conductive material. ### Claim 15 (depends on 14) The cap as claimed in claim 14, wherein the conductive material is a metallic material. ### Claim 16 (depends on 15) The cap as claimed in claim 15, wherein the metallic material is one of copper and iron. ### Claim 17 (depends on 14) The cap as claimed in claim 14, wherein the non-conductive material is a non-metallic material. ### Claim 18 (depends on 17) The cap as claimed in claim 17, wherein the non-metallic material is one of plastics and rubber. ### Claim 19 (depends on 14) The cap as claimed in claim 14, wherein the inner layer is a base layer, and the outer layer is a coating layer. ### Claim 20 (depends on 14) The cap as claimed in claim 14, wherein the inner layer is a coating layer, and the outer layer is a base layer. ### Claim 21 (depends on 19) The cap as claimed in claim 19, wherein the thickness of the base layer is larger than that of the coating layer. ### Claim 22 A method for manufacturing a cap comprising the following steps of: providing an inner layer acted as a base layer; and forming an outer layer on a surface of the inner layer so as to form a cap, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion, the inner layer is made of a non-conductive material, and the outer layer is made of a conductive material. ### Claim 23 (depends on 22) The method as claimed in claim 22, wherein the outer layer is a coating layer. ### Claim 24 (depends on 23) The method as claimed in claim 23, wherein the thickness of the base layer is larger than that of the coating layer. ### Claim 25 A method for manufacturing a cap comprising the following steps of: providing an outer layer acted as a base layer; and forming an inner layer on a surface of the outer layer so as to form a cap, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion, the inner layer is made of a non-conductive material, and the outer layer is made of a conductive material. ### Claim 26 (depends on 25) The method as claimed in claim 25, wherein the inner layer is a coating layer. ### Claim 27 (depends on 26) The method as claimed in claim 26, wherein the thickness of the base layer is larger than that of the coating layer.