# US 2009/0260862 A1 · Circuit modification device for printed circuit boards > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0260862 A1 - Document ID: US20090260862A1 - Status: Published application - Kind: A1 - Application number: 12/104,330 - Filed: 2008-04-16 - Published: 2009-10-22 - Earliest claimed: 2008-04-16 - Inventors: Andrew Yaung; Neal S. Greenberg - Web page: https://patentgrep.com/patent/US20090260862A1 ## CPC - H05K 3/225: {Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 3/305: {Affixing by adhesive} - H05K 3/3421: {Leaded components} - H05K 3/3452: Solder masks - H05K 2201/10689: Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] - H05K 2203/0195: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and electrically couple to a lead of an electrical component. At least one masking layer is positioned to electrically isolate the plurality of electrically-conductive traces, one from another. ## Claims ### Claim 1 An electronic circuit modification apparatus, comprising: an adhesive layer; an insulating layer formed over the adhesive layer; a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon, the electrically-conductive bonding layer configured to mechanically mount and electrically couple to a lead of an electrical component; and at least one masking layer positioned to electrically isolate the plurality of electrically-conductive traces, one from another. ### Claim 2 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the adhesive layer is temporarily protected by a removable backing release layer. ### Claim 3 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the adhesive layer is a pressure-sensitive adhesive. ### Claim 4 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the electrically-conductive bonding layer comprises solder. ### Claim 5 (depends on 4) The electronic circuit modification apparatus of claim 4 wherein the solder is a tin/lead alloy. ### Claim 6 (depends on 4) The electronic circuit modification apparatus of claim 4 wherein the solder is a flux-core solder. ### Claim 7 (depends on 4) The electronic circuit modification apparatus of claim 4 wherein the solder is a fusible metal alloy. ### Claim 8 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the electrically-conductive bonding layer comprises an electrically-conductive polymer material. ### Claim 9 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the at least one masking layer is formed to be at a higher cross-sectional level than an uppermost portion of the electrically-conductive bonding layer. ### Claim 10 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the at least one masking layer is formed to be substantially coplanar to an uppermost portion of the electrically-conductive bonding layer. ### Claim 11 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the plurality of electrically-conductive traces are configured to provide electrical coupling from an uppermost portion of the circuit modification apparatus to a lowermost portion of the adhesive layer. ### Claim 12 (depends on 1) The electronic circuit modification apparatus of claim 1 wherein the adhesive layer and the insulating layer are non-continuous thereby allowing at least certain ones of the electrically-conductive traces to provide an electrical coupling path through a cross-sectional thickness of the circuit modification apparatus. ### Claim 13 A flexible circuit for repairing defects in a circuit assembly on a printed circuit board, the flexible circuit comprising: a pressure-sensitive adhesive layer having a release backing material affixed thereto, the release backing material configured to be readily removable; an insulating layer disposed over at least a portion of the pressure-sensitive adhesive layer; a plurality of electrically-conductive traces formed in contact with at least portions of the insulating layer, each of the plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon, the electrically-conductive bonding layer configured to mechanically mount and electrically couple to a lead of an electrical component; and at least one masking layer positioned to electrically isolate the plurality of electrically-conductive traces, one from another. ### Claim 14 (depends on 13) The electronic circuit modification apparatus of claim 13 wherein the electrically-conductive bonding layer comprises solder. ### Claim 15 (depends on 14) The electronic circuit modification apparatus of claim 14 wherein the solder is a tin/lead alloy. ### Claim 16 (depends on 14) The electronic circuit modification apparatus of claim 14 wherein the solder is a flux-core solder. ### Claim 17 (depends on 14) The electronic circuit modification apparatus of claim 14 wherein the solder is a fusible metal alloy. ### Claim 18 (depends on 13) The electronic circuit modification apparatus of claim 13 wherein the electrically-conductive bonding layer comprises an electrically-conductive polymer material. ### Claim 19 (depends on 13) The electronic circuit modification apparatus of claim 13 wherein the at least one masking layer is formed to be at a higher cross-sectional level than an uppermost portion of the electrically-conductive bonding layer. ### Claim 20 (depends on 13) The electronic circuit modification apparatus of claim 13 wherein the at least one masking layer is formed to be substantially coplanar to an uppermost portion of the electrically-conductive bonding layer. ### Claim 21 (depends on 13) The electronic circuit modification apparatus of claim 13 wherein the plurality of electrically-conductive traces are configured to provide electrical coupling from an uppermost portion of the circuit modification apparatus to a lowermost portion of the adhesive layer. ### Claim 22 (depends on 13) The electronic circuit modification apparatus of claim 13 wherein the adhesive layer and the insulating layer are non-continuous thereby allowing at least certain ones of the electrically-conductive traces to provide an electrical coupling path through a cross-sectional thickness of the circuit modification apparatus. ### Claim 23 A flexible circuit modification device to repair defects in a circuit assembly on a printed circuit board, the flexible circuit comprising: a pressure-sensitive adhesive layer having a release backing material affixed thereto, the release backing material configured to be readily removable; an insulating layer disposed over at least a portion of the pressure-sensitive adhesive layer; a plurality of electrically-conductive traces in contact with at least portions of the insulating layer, each of the plurality of electrically-conductive traces having a solder-laden electrically-conductive bonding layer formed thereupon, the solder-laden electrically-conductive bonding layer configured to mechanically mount and electrically couple to a lead of an electrical component; and at least one masking layer formed to be at a higher cross-sectional level than an uppermost portion of the electrically-conductive bonding layer thereby forming a trench surrounding each of the solder-laden electrically-conductive bonding layers, the at least one masking layer being arranged to electrically isolate the plurality of electrically-conductive traces, one from another. ### Claim 24 (depends on 23) The electronic circuit modification apparatus of claim 23 wherein the solder is a tin/lead alloy. ### Claim 25 (depends on 23) The electronic circuit modification apparatus of claim 23 wherein the solder is a flux-core solder. ### Claim 26 (depends on 23) The electronic circuit modification apparatus of claim 23 wherein the solder is a fusible metal alloy. ### Claim 27 (depends on 23) The electronic circuit modification apparatus of claim 23 wherein the plurality of electrically-conductive traces are configured to provide electrical coupling from an uppermost portion of the circuit modification apparatus to a lowermost portion of the adhesive layer. ### Claim 28 (depends on 23) The electronic circuit modification apparatus of claim 23 wherein the adhesive layer and the insulating layer are non-continuous thereby allowing at least certain ones of the electrically-conductive traces to provide an electrical coupling path through a cross-sectional thickness of the circuit modification apparatus.