# US 2009/0260758 A1 · Method for bonding a first component to a second component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0260758 A1 - Document ID: US20090260758A1 - Status: Published application - Kind: A1 - Application number: 12/425,602 - Filed: 2009-04-17 - Published: 2009-10-22 - Earliest claimed: 2008-04-18 - Assignees: Henkel AG & Co. KGaA - Inventors: Manfred Kosche, JR.; Dirk Scheidle, JR. - Web page: https://patentgrep.com/patent/US20090260758A1 ## CPC - C09J 5/06: involving heating of the applied adhesive - C03C 27/048: {consisting of an adhesive specially adapted for that purpose} - C09J 5/10: Joining materials by welding overlapping edges with an insertion of plastic material - C09J 2400/143: in the substrate - C09J 2400/163: in the substrate - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS ## Abstract A process for bonding a first component to a second component that possesses a border area, with which the first component is overlappingly bonded, wherein a) at least one hot melt adhesive compound deposited on the first component such that said compound comes into contact with the border area of the second component, b) a spot, on which said deposited hot melt adhesive compound comes into contact with the border area, said border area is indirectly or directly locally heated by means of electromagnetic induction to a temperature above the melting point of the hot melt adhesive, c) the first component is contacted with the border area of the second component in such a way that the hot melt adhesive compound comes into contact with the spot of the border area which was heated in step b) such that the hot melt adhesive at the point of contact with the border area melts, and after cooling bonds the first component with the border area of the second component, d) wherein additionally, prior to step b) or after step c), a reactive adhesive is introduced between the first and the second component such that it bonds the first component to the border area of the second component, and e) the reactive adhesive cures or is allowed to cure, wherein, in step a), the hot melt adhesive compound, without being heated, is adhered to the first component using a further adhesive. ## Claims ### Claim 1 A process for bonding a first component to a second component that possesses a border area, with which the first component is overlappingly bonded, comprising the steps of: a) at least one hot melt adhesive compound is bonded to the first component such that on bonding the first component to the second component, said compound comes into contact with the border area; b) on at least one spot, on which said deposited hot melt adhesive compound comes into contact with the border area when bonding the first component, said border area is indirectly or directly locally heated by means of electromagnetic induction to a temperature above the melting point of the hot melt adhesive; c) the first component is contacted with the border area of the second component in such a way that the hot melt adhesive compound comes into contact with the spot of the border area which was heated in step b) such that the hot melt adhesive at the point of contact with the border area melts, and after cooling bonds the first component with the border area of the second component; d) wherein additionally, prior to step b) or after step c), a reactive adhesive is introduced between the first and the second component such that the reactive adhesive bonds the first component to the border area of the second component, and e) the reactive adhesive cures or is allowed to cure; wherein, in step a), the hot melt adhesive compound, without being heated, is adhered to the first component with help from a further adhesive. ### Claim 2 (depends on 1) The process according to claim 1, wherein a one-component or two-component reactive adhesive is used in step a) as the further adhesive. ### Claim 3 (depends on 2) The process according to claim 2, wherein an adhesive based on cyanoacrylates, acrylates or epoxides is used as the further adhesive. ### Claim 4 (depends on 1) The process according to claim 1, wherein as step d), prior to step b) the reactive adhesive is applied on the first component such that on bonding the first component with the second component in step c), the reactive adhesive comes into contact with the border area of the second component. ### Claim 5 (depends on 1) The process according to claim 1, wherein as step d), prior to step b) the reactive adhesive is applied on the border area of the second component such that on bonding the first component with the border area of the second component, the reactive adhesive comes into contact with the first component, wherein those points of the border area which come into contact with the hot melt adhesive compound in the subsequent step c) remain free of said reactive adhesive. ### Claim 6 (depends on 1) The process according to claim 1, wherein as step d), the reactive adhesive of step c) is introduced into a gap between the first component and the border area of the second component. ### Claim 7 (depends on 4) The process according to claim 4, wherein the reactive adhesive is deposited or introduced in the form of an adhesive bead. ### Claim 8 (depends on 1) The process according to claim 1, wherein the hot melt adhesive compound is shaped in such a way that the hot melt adhesive compound exhibits two approximately parallel surfaces, wherein the first parallel surface comes into contact with the first component and the second parallel surface comes into contact with the border area of the second component. ### Claim 9 (depends on 1) The process according to claim 1, wherein the hot melt adhesive comprises one or more of the following components or consists of them: polyolefin, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, polyamide, polyester, polyurethane, butadiene styrene block polymer. ### Claim 10 (depends on 1) The process according to claim 1, wherein the hot melt adhesive comprises one or more of the following components: cycloaliphatic hydrocarbon resin; copolymer of styrene with isoprene and/or α-methyl styrene, which can be optionally hydrogenated; hydrogenated polydecene; copolymer of maleic anhydride with ethylene and/or propylene. ### Claim 11 (depends on 1) The process according to claim 1, wherein the reactive adhesive is a one-component polyurethane adhesive, an epoxy resin adhesive, an acrylate adhesive or sealant or a silicone adhesive or sealant or a two-component reactive adhesive. ### Claim 12 (depends on 1) The process according to claim 1, wherein the first component, after bonding with the hot melt adhesive compound(s) and prior to bonding the second component, is stored and/or transported. ### Claim 13 (depends on 1) The process according to claim 1, wherein the first component is grasped with a handling device, the hot melt compound(s) is/are then bonded to the first component and subsequently, using the same handling device, the first component, without any intermediate storage, is brought into contact with the second component. ### Claim 14 (depends on 13) The process according to claim 13, wherein the handling device possesses one or more heating means, with which in step b) the border area of the second component can be indirectly or directly locally heated by means of electromagnetic induction on at least one spot, on which the deposited hot melt adhesive compound comes into contact with the border area when bonding the first component. ### Claim 15 (depends on 1) The process according to claim 1, wherein the second component, at least in the border area, is metallic and the border area is directly locally heated by means of electromagnetic induction on at least one spot, on which the deposited hot melt adhesive compound comes into contact with the border area when bonding the first component.