# US 2009/0260675 A1 · Encapsulation of solar modules

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- Number: US 2009/0260675 A1
- Document ID: US20090260675A1
- Status: Published application
- Kind: A1
- Application number: 12/106,210
- Filed: 2008-04-18
- Published: 2009-10-22
- Earliest claimed: 2008-04-18
- Inventors: Serkan Erdemli; Burak Metin
- Web page: https://patentgrep.com/patent/US20090260675A1

## CPC

- H10F 19/30: comprising thin-film photovoltaic cells
- H10F 19/80: Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F 19/804: {Materials of encapsulations}
- H10F 19/85: Protective back sheets
- H10F 19/902: {for series or parallel connection of photovoltaic cells}
- Y02E 10/50: Photovoltaic [PV] energy
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

A method for encapsulating interconnected solar cells including Group IBIIIAVIA absorbers and an apparatus according to the same, whereby a light receiving side encapsulant layer including thermoplastic polyurethane is used to cover the light receiving sides of the interconnected solar cells. The back sides of the interconnected solar cells are covered with a back side encapsulant layer that is different from the light receiving side encapsulant layer.

## Claims

### Claim 1

A solar cell module, comprising:
a solar cell device including at least two solar cells, each solar cell including a Group IBIIIAVIA absorber layer and a conductive substrate, wherein the solar cell device comprises a light receiving side having a light receiving surface and a back side having a back surface, the light receiving side of the device comprising the Group IBIIIAVIA absorber layer of each solar cell and the back side comprising the conductive substrate of each solar cell;
a light receiving side encapsulant layer coating the light receiving surface, wherein the light receiving side encapsulant comprises a thermoplastic polyurethane; and
a back side encapsulant layer coating the back surface, wherein the back side encapsulant layer is different from the light receiving side encapsulate layer.

### Claim 2 (depends on 1)

The solar cell module of claim 1, wherein the back side encapsulant layer comprises ethylene vinyl acetate copolymer.

### Claim 3 (depends on 1)

The solar cell module of claim 1, wherein the back side encapsulant comprises a non-transparent material.

### Claim 4 (depends on 1)

The solar cell module of claim 1 further comprising a front protective layer disposed over the light receiving side encapsulant layer.

### Claim 5 (depends on 4)

The solar cell module of claim 4, wherein the front protective layer comprises one of glass and ETFE (ethylene tetrafluoroethylene).

### Claim 6 (depends on 4)

The solar cell module of claim 4, wherein the back protective layer has a stacked structure comprising sheets of PVF (polyvinyl fluoride) and aluminum.

### Claim 7 (depends on 4)

The solar cell module of claim 4, wherein the back protective layer has a stacked structure comprising sheets of PEN (polyethylene naphthalate) and aluminum.

### Claim 8 (depends on 4)

The solar cell module of claim 4, wherein the back protective layer has a stacked structure comprising sheets of PET (polyethylene terephthalate) and aluminum.

### Claim 9 (depends on 4)

The solar cell module of claim 4, wherein the conductive substrate is stainless steel.

### Claim 10 (depends on 1)

The solar cell module of claim 1 further comprising a back protective layer disposed under the back side encapsulant layer.

### Claim 11 (depends on 10)

The solar cell module of claim 10, wherein the back protective layer comprises one of glass and PVF (polyvinyl fluoride).

### Claim 12 (depends on 1)

The solar cell module of claim 1, wherein the light receiving side encapsulant layer has a thickness range of 20-25 mils.

### Claim 13 (depends on 1)

The solar cell module of claim 1, wherein the back side encapsulant layer has a thickness range of 12-18 mils.

### Claim 14

A method of manufacturing a solar module, comprising:
providing a front protective layer having a front surface and a back surface, wherein the front protective layer is transparent;
placing a light receiving side encapsulant layer over the back surface of the front protective layer, wherein the light receiving side encapsulant comprises thermoplastic polyurethane;
placing a solar cell device over the light receiving side encapsulant layer, wherein the solar cell device includes at least two solar cells, and each solar cell includes a Group IBIIIAVIA absorber layer and a conductive substrate, the solar cell device comprising a light receiving side having a top surface and a back side having a back surface, the light receiving side of the device comprising the Group IBIIIAVIA absorber layer of each solar cell and the back side comprising the conductive substrate of each solar cell, and wherein the top surface of the solar cell device faces the light receiving side encapsulant layer;
placing a back side encapsulant layer over the back surface of the solar cell device, wherein the back side encapsulant layer is different from the light receiving side encapsulant layer;
placing a back protective layer over the back side encapsulant layer, and thereby forming a multilayer structure;
subjecting the multilayer structure heat and pressure to melt the light receiving side encapsulant layer between the front protective layer and the solar light receiving side of the solar cell and back side encapsulant layer between the back side of the solar cell and the back protective layer; and
cooling the multilayer structure to bond the light receiving side encapsulant layer between to the front protective layer and the solar light receiving side of the solar cell, and back side encapsulant layer to the back side of the solar cell and the back protective layer.

### Claim 15 (depends on 14)

The method of claim 14, wherein the back side encapsulant layer comprises ethylene vinyl acetate copolymer.

### Claim 16 (depends on 14)

The method of claim 14, wherein the step of subjecting the multilayer structure to heat and pressure comprises applying a temperature range of 120° C. to 160° C., a pressure range of 0.5 to 1 atm.

### Claim 17 (depends on 14)

The method of claim 14, wherein the front protective layer comprises one of glass and ETFE (ethylene tetrafluoroethylene).

### Claim 18 (depends on 14)

The method of claim 14, wherein the back protective layer comprises one of glass and PVF (polyvinyl fluoride).