# US 2009/0260568 A1 · Glue dispenser and glue dispensing process

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- Number: US 2009/0260568 A1
- Document ID: US20090260568A1
- Status: Published application
- Kind: A1
- Application number: 12/273,701
- Filed: 2008-11-19
- Published: 2009-10-22
- Earliest claimed: 2008-04-18
- Assignees: Hon Hai Precision Industry Co., Ltd.
- Inventors: Hsin-Hung Chuang
- Web page: https://patentgrep.com/patent/US20090260568A1

## CPC

- B05C 5/0216: {by relative movement of article and outlet according to a predetermined path}
- B05C 9/14: the auxiliary operation involving heating {or cooling}
- B29D 11/0073: {Optical laminates}
- G02B 7/025: {using glue}
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

An exemplary glue dispenser for dispensing a glue on a workpiece includes a nozzle for dispensing the glue on the workpiece, a working platform for supporting a workpiece thereon, and a heating device mounted on the working platform. The heating device is configured for maintaining the workpiece in an elevated temperature, which is higher than a temperature of the glue.

## Claims

### Claim 1

A glue dispenser for dispensing a glue on a workpiece, comprising:
a nozzle for dispensing the glue on the workpiece;
a working platform for supporting the workpiece thereon; and
a heating device mounted on the working platform and configured for maintaining the workpiece at an elevated temperature, the elevated temperature being higher than a temperature of the glue.

### Claim 2 (depends on 1)

The glue dispenser as claimed in claim 1, further comprising a controller, wherein the controller is electrically connected with the heating element, and is configured for controlling the heating element.

### Claim 3 (depends on 2)

The glue dispenser as claimed in claim 2, further comprising a temperature detector configured for detecting a temperature of the workpiece, wherein the temperature detector is electrically connected with the controller, and is for thermally connecting with the workpiece.

### Claim 4 (depends on 1)

The glue dispenser as claimed in claim 1, further comprising a controller, wherein the controller is coupled to the nozzle, and is configured for controlling a glue dispensing rate of the nozzle.

### Claim 5 (depends on 1)

The glue dispenser as claimed in claim 1, further comprising a driving device for driving the nozzle to move toward and away from the workpiece.

### Claim 6 (depends on 5)

The glue dispenser as claimed in claim 5, further comprising a controller connected with the driving device and configured for controlling movement of the driving device.

### Claim 7

A glue dispenser for dispensing a glue on a workpiece, comprising:
a controller;
a nozzle for dispensing a glue on a workpiece, the nozzle being connected with the controller;
a working platform for supporting the workpiece thereon;
a heating device mounted on the working platform and electrically connected with the controller, the heating device being configured for maintaining the workpiece at an elevated temperature, the elevated temperature being higher than a temperature of the glue; and
a temperature detector configured for detecting a temperature of the workpiece, wherein the temperature detector is electrically connected with the controller, and r is for thermally connecting with the workpiece.

### Claim 8 (depends on 7)

The glue dispenser as claimed in claim 7, further comprising a driving device for driving the nozzle to move toward and away from the workpiece, wherein the controller is connected with the driving device, and is configured for controlling movement of the driving device.

### Claim 9

A dispensing process for applying a glue onto a workpiece, the process comprising:
heating a workpiece to an elevated temperature, the elevated temperature being higher than a temperature of the glue; and
applying the glue onto the workpiece.

### Claim 10 (depends on 9)

The dispensing process as claimed in claim 9, wherein the workpiece is heated up to an elevated temperature which is 5° C.-20° C. higher than the temperature of the glue.