# US 2009/0260459 A1 · Probe substrate and probe card having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0260459 A1 - Document ID: US20090260459A1 - Status: Published application - Kind: A1 - Application number: 12/157,507 - Filed: 2008-06-11 - Published: 2009-10-22 - Earliest claimed: 2008-04-21 - Assignees: Willtechnology Co., Ltd. - Inventors: Hongchan Kim - Web page: https://patentgrep.com/patent/US20090260459A1 ## CPC - G01R 1/07307: {with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card} - G01R 1/07357: {with flexible bodies, e.g. buckling beams} - G01R 3/00: Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A probe card includes a printed circuit board; at least one probe substrate including a probe substrate body disposed on the printed circuit board and at least one probe through hole extending by passing through the probe substrate body; and at least one probe including a probe body supported by the probe substrate and a probe lead part extending from the probe body to an inside of the probe through hole in the printed circuit board, wherein the probe substrate body includes at least one fixing slit which extends in an X axis direction at one side surface of the probe substrate body where the probe body is exposed, and has a width substantially equal to a thickness of the probe; and at least some of the probe bodies are received in the fixing slit so that the probes are arranged in the a Y axis direction. ## Claims ### Claim 1 A probe card comprising: a printed circuit board; at least one probe substrate including a probe substrate body disposed on the printed circuit board and at least one probe through hole extending by passing through the probe substrate body; and at least one probe including a probe body supported by the probe substrate and a probe lead part extending from the probe body to an inside of the probe through hole in the printed circuit board, wherein the probe substrate body includes at least one fixing slit which extends in an X axis direction at one side surface of the probe substrate body where the probe body is exposed, and has a width substantially equal to a thickness of the probe; and at least some of the probe bodies are received in the fixing slit so that the probes are arranged in the a Y axis direction. ### Claim 2 (depends on 1) The probe card of claim 1, wherein the probe substrate body further includes at least one first groove which extends in the Y axis direction at the other side surface facing the one side surface; and the probe through hole is formed in an intersecting portion of the fixing slit and the first groove. ### Claim 3 (depends on 2) The probe card of claim 2, wherein the fixing slit and the first groove are formed by a dicing process. ### Claim 4 (depends on 2) The probe card of claim 2, wherein the probe substrate body further includes at least one second groove which extends in the Y axis direction at the one side surface of the probe substrate body where the probe body is exposed, and further includes a protruded part having a width substantially equal to a width of the second groove; and the protruded part is received in the second groove so that the probe is arranged in the X axis direction. ### Claim 5 (depends on 1) The probe card of claim 1, wherein the probe substrate body further includes at least one guide hole which extends from the other side surface facing the one side surface to the fixing slit; and the probe through hole is formed by communicating the fixing slit with the guide hole. ### Claim 6 (depends on 5) The probe card of claim 5, wherein the fixing slit is formed by a dicing process and the guide hole is formed by a drilling process. ### Claim 7 (depends on 1) The probe card of claim 1, wherein the probe substrate body includes a ceramic substrate. ### Claim 8 (depends on 7) The probe card of claim 7, wherein the probe through hole is formed by a photolithography process. ### Claim 9 A probe substrate for a probe card used for arranging a probe, comprising: a probe substrate body supporting the probe; at least one probe through hole extending by passing through the probe substrate body, and through which the probe passes, wherein the probe substrate body includes at least one fixing slit which extends in an X axis direction at one side surface of the probe substrate body where the probe is exposed, and has a width substantially equal to a thickness of the probe; and at least some of the probes are received in the fixing slit so that the probes are arranged in the a Y axis direction. ### Claim 10 (depends on 9) The probe substrate of claim 9, wherein the probe substrate body further includes at least one first groove which extends in the Y axis direction at the other side surface facing the one side surface; and the probe through hole is formed in an intersecting portion of the fixing slit and the first groove. ### Claim 11 (depends on 10) The probe substrate of claim 10, wherein the fixing slit and the first groove are formed by a dicing process. ### Claim 12 (depends on 10) The probe substrate of claim 10, wherein the probe substrate body further includes at least one second groove which extends in the Y axis direction at the one side surface of the probe substrate body where the probe body is exposed, and the probe includes a protruded part having a width substantially equal to a width of the second groove; and the protruded part is received in the second groove so that the probes are arranged in the X axis direction. ### Claim 13 (depends on 9) The probe substrate of claim 9, wherein the probe substrate body further includes at least one guide hole which extends from the other side surface facing the one side surface to the fixing slit; and the probe through hole is formed by communicating the fixing slit with the guide hole. ### Claim 14 (depends on 13) The probe substrate of claim 13, wherein the fixing slit is formed by a dicing process and the guide hole is formed by a drilling process. ### Claim 15 (depends on 9) The probe substrate of claim 9, wherein the probe substrate body includes a ceramic substrate. ### Claim 16 (depends on 15) The probe substrate of claim 15, wherein the probe through hole is formed by a photolithography process.