Radio frequency (rf) integrated circuit (ic) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities

A method of fabricating a radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least two, said method comprising the steps of:

• providing a package comprising:
• N generally planar patches;
• at least one generally planar ground plane spaced inwardly from said N generally planar patches and substantially parallel thereto, said ground plane being formed with at least N coupling aperture slots therein, said slots being substantially opposed to said patches;
• N feed lines spaced inwardly from said ground plane and substantially parallel thereto;
• a first substrate layer spaced inwardly from said feed lines, said first substrate layer being formed with a chip-receiving cavity;
• a second substrate layer interposed in a region between said ground plane and a plane defined by said patch, wherein:
• said patch is formed in a first metal layer;
• said ground plane is formed in a second metal layer;
• and
• said second substrate layer defines an antenna cavity, said N generally planar patches being located in said antenna cavity;
• and
• an island formed in said second substrate layer, within said antenna cavity, thus defining a ring shape of said cavity, said island being substantially opposed to said chip-receiving cavity;
• and
• inserting at least one radio frequency chip into said chip-receiving cavity, with said island supporting loads induced by said insertion of said chip into said chip-receiving cavity.

A method of fabricating a radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least two, said method comprising the steps of:

• providing a package comprising:
• N generally planar patches;
• at least one generally planar ground plane spaced inwardly from said N generally planar patches and substantially parallel thereto, said ground plane being formed with at least N coupling aperture slots therein, said slots being substantially opposed to said patches;
• N feed lines spaced inwardly from said ground plane and substantially parallel thereto;
• a first substrate layer spaced inwardly from said feed lines, said first substrate layer being formed with a chip-receiving cavity;
• a second substrate layer interposed in a region between said ground plane and a plane defined by said patch, wherein:
• said patch is formed in a first metal layer;
• said ground plane is formed in a second metal layer;
• said second substrate layer defines an antenna cavity, said N generally planar patches being located in said antenna cavity;
• and
• said antenna cavity is spaced away from said chip-receiving cavity when viewed in plan;
• and
• inserting at least one radio frequency chip into said chip-receiving cavity, such that loads incurred during insertion of said chip into said chip-receiving cavity are substantially supported away from said antenna cavity.