Integrated circuit package-on-package system with central bond wires
AssigneeSTATS ChipPAC, Ltd.
InventorsDeokKyung Yang, Jae Han Chung, Hyun Joung Kim
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Abstract
An integrated circuit package-on-package system includes: providing a base substrate having a central opening; attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate; attaching a top die above the base substrate partially covering the central opening; attaching external conductive interconnections to a base bottom surface of the base substrate; and molding an encapsulant leaving the external conductive interconnections partially exposed.
Claims20
An integrated circuit package-on-package system comprising:
- providing a base substrate having a central opening;
- attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate;
- attaching a top die above the base substrate partially covering the central opening with a first wire-in-film adhesive;
- attaching external conductive interconnections to a base bottom surface of the base substrate;
- and
- molding an encapsulant leaving the external conductive interconnections partially exposed.
(canceled)
An integrated circuit package-on-package system comprising:
- providing a base substrate having a central opening;
- attaching a bottom die below the base substrate using a first attachment material;
- connecting the bottom die through the central opening to a top surface of the base substrate using bottom die electrical interconnections;
- attaching the top die above the base substrate using a first wire-in-film adhesive;
- mounting external conductive interconnections on a base bottom surface of the base substrate;
- connecting the top die to the base substrate using top die electrical interconnections;
- and
- molding an encapsulant over the bottom die and the top die.
An integrated circuit package-on-package system comprising:
- a base substrate with a central opening;
- a bottom die attached below the base substrate partially covers the central opening, the bottom die connected through the central opening to a top surface of the base substrate;
- a top die above the base substrate partially covers the central opening;
- a first wire-in-film adhesive attaches the top die to the base substrate;
- external conductive interconnections attached to a base bottom surface of the base substrate;
- and
- an encapsulant molded around the top die and the bottom die leaves the external conductive interconnections partially exposed.
(canceled)
Dependencies are inferred from the claim text.