US 2009/0256252 A1 · Semiconductor Die Packages With Multiple Integrated Substrates, Systems Using the Same, and Methods Using the Same

Abstract

An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate that is electrical coupled to the first substrate, and an electrically insulating material disposed over portions of the substrates. The first substrate may hold power-handling devices and may be specially constructed to dissipation heat and to facilitate fast and inexpensive manufacturing. The second substrate may hold packaged components of control circuitry for the power-handling devices, and may be specially constructed to enable fast and inexpensive wiring design and fast and inexpensive component assembly. The first substrate may be used with different designs of the second substrate.

Claims28

Dependent claims

A semiconductor die package comprising:

a first major surface and a second major surface opposite to the first major surface;
a first substrate disposed between the first and second major surfaces, the first substrate having a plurality of electrically conductive regions;
a second substrate disposed between the first and second major surfaces, the second substrate having a plurality of electrically conductive regions;
at least one semiconductor die disposed on the first substrate and electrically coupled to at least one of the first substrate's conductive regions;
at least one packaged electrical component disposed on the second substrate and electrically coupled to at least one of the second substrate's conductive regions;
a plurality of electrical connections between the first and second substrates;
and
a plurality of electrical connection points to the package, each connection point being disposed at one of the major surfaces and electrically coupled to at least one of the semiconductor die and packaged electrical component.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor Die Packages With Multiple Integrated Substrates, Systems Using the Same, and Methods Using the Same

Life of this patent

Semiconductor Die Packages With Multiple Integrated Substrates, Systems Using the Same, and Methods Using the Same

Life of this patent

Abstract

Claims28