Back to results
US 2009/0256249 A1Published application
Stacked, interconnected semiconductor package
AssigneeSanDisk Technologies LLC
InventorsCheemen Yu, Chih-Chin Liao, Hem Takiar
Life of this patent
Estimating the term…
Abstract
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.
Claims20
A semiconductor package assembly, comprising:
- a first semiconductor package, including:
- a first substrate having first and second opposed surfaces, the first substrate having a first set of contact pads on the first surface and a second set of contact pads on the second surface,
- a first set of one or more semiconductor die mounted on the first surface of the first substrate,
- a first encapsulant for encapsulating at least the first semiconductor die, the encapsulant having a plurality of recesses in a surface of the encapsulant, and
- a plurality of electrical connectors, an electrical connector of the plurality of electrical connectors including:
- a base portion affixed to a contact pad of the second set of contact pads on the second surface of the first substrate,
- a neck portion extending from the base portion away from the contact pad, the neck portion being outside of the encapsulant, and
- a head portion extending from the neck portion and fitting within a recess of the plurality of recesses in the surface of the first encapsulant;
- and
- a second semiconductor package stacked on the first semiconductor package, including:
- a second substrate having third and fourth opposed surfaces, the second substrate having a third set of contact pads on the third surface, the head portion of the electrical connector affixed to a contact pad of the third set of contact pads,
- a second set of one or more semiconductor die mounted on the fourth surface of the second substrate, and
- a second encapsulant for encapsulating at least the second semiconductor die.
10 more elements
A semiconductor package assembly, comprising:
- a first semiconductor package, including:
- a first substrate having first and second opposed surfaces, the first substrate having a first set of contact pads on the first surface and a second set of contact pads on the second surface,
- a first set of one or more semiconductor die mounted on the first surface of the first substrate,
- a first encapsulant for encapsulating at least the first semiconductor die, and
- a plurality of electrical connectors, an electrical connector of the plurality of electrical connectors including:
- a first portion affixed to a contact pad of the second set of contact pads on the second surface of the first substrate, and
- a second portion connected to the first portion and extending over an exterior surface of the first encapsulant;
- and
- a second semiconductor package stacked on the first semiconductor package, including:
- a second substrate having third and fourth opposed surfaces, the second substrate having a third set of contact pads on the third surface, a contact pad of the third set of contact pads connected to the second portion of the electrical connector,
- a second set of one or more semiconductor die mounted on the fourth surface of the second substrate, and
- a second encapsulant for encapsulating at least the second semiconductor die.
9 more elements
A semiconductor package assembly, comprising:
- a first semiconductor package, including:
- a first substrate having first and second opposed surfaces, the first substrate having a first set of contact pads on the first surface and a second set of contact pads on the second surface,
- a first set of one or more semiconductor die mounted on the first surface of the first substrate,
- a first encapsulant for encapsulating at least the first semiconductor die;
- and
- a second semiconductor package stacked on the first semiconductor package, including:
- a second substrate having third and fourth opposed surfaces, the second substrate having a third set of contact pads on the third surface,
- a second set of one or more semiconductor die mounted on the fourth surface of the second substrate, and
- a second encapsulant for encapsulating at least the second semiconductor die;
- and
- a plurality of electrical connectors, an electrical connector of the plurality of electrical connectors mounted to an exterior of the first package and electrically connecting a contact pad of the second set of contact pads of the first substrate to a contact pad of the third set of contact pads of the second substrate.
8 more elements
Dependencies are inferred from the claim text.