Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device

2:

• The semiconductor package according to claim 1 wherein the step is formed throughout the perimeter.

3:

• The semiconductor package according to claim 1 wherein the step is a cutout part where resin of the resin sealing member is removed.

4:

• The semiconductor package according to claim 1 wherein the semiconductor chip is an image sensor.

5:

• The semiconductor package according to claim 4 wherein
• the resin sealing member seals with resin an area other than a light transmitting area of the image sensor, and
• the light transmitting area is covered with a translucent cover with space therebetween.

7:

• The method according to claim 6 wherein,
• in the step forming step, a single board forming the plurality of the semiconductor package is divided into the plurality of the semiconductor package.

9:

• The method according to claim 7 wherein
• cutting means used in the first cutting step is thicker than that used in the second cutting step.

10:

• A semiconductor module in which a mounting component is attached to the semiconductor package according to claim 1, wherein
• the mounting component has a fitting member which fits in the step of the semiconductor package, and
• the step and the fitting member allow the semiconductor package and the mounting component to be joined to each other.

11:

• The semiconductor module according to claim 10 wherein the step and the fitting member are joined to each other via an adhesive.

12:

• The semiconductor module according to claim 11 wherein
• the mounting component is a lens member in which a lens is held by a lens holder.

13:

• The semiconductor module according to claim 10 wherein
• the surface of the resin sealing member other than the step is in contact with the mounting component.

14:

• An electronic device including the semiconductor module according to claim 10.