Deposition Substrate and Method for Manufacturing Light-Emitting Device

A method for manufacturing a light-emitting device, comprising:

• disposing a first substrate and a second substrate having a first electrode so that the first substrate faces the first electrode, the first substrate including a first region and a second region and being capable of transmitting light;
• the first region including:
• a first heat-insulating layer provided over the first substrate, the first heat-insulating layer being capable of transmitting the light;
• a light absorption layer provided over the first heat-insulating layer, the light absorption layer being capable of absorbing the light, and
• a first organic compound-containing layer provided over the light absorption layer;
• the second region including:
• a reflective layer provided over the first substrate, the reflective layer being capable of reflecting the light;
• a second heat-insulating layer provided over the reflective layer, and a second organic compound-containing layer provided over the second heat-insulating layer,
• wherein an edge of the second heat-insulating layer is placed inside an edge of the reflective layer, and
• wherein a space is provided between the first heat-insulating layer and the second heat-insulating layer,
• irradiating the light absorption layer with the light through the first substrate and the first heat-insulating layer to evaporate the first organic compound-containing layer, thereby forming a light-emitting layer on the first electrode;
• and
• forming a second electrode layer on the light-emitting layer.