Semiconductor light-emitting device
AssigneePanasonic Corporation
InventorsSusumu Koike, Masaaki Suzuki, Tadaaki Ikeda, Hideo Nagai
Life of this patent
Estimating the term…
Abstract
A semiconductor light-emitting device 10 has a semiconductor chip 12 for emitting light having a wavelength in blue to ultraviolet regions, and a sealing portion 16 formed in at least a partial region on a passage path on which the light is passed. The sealing portion 16 includes a sealing material 16d which is a composite material including a matrix material 16a made of a resin, nano-particles 16b made of an inorganic material which are distributed in the matrix material 16a, the nano-particle 16b having an effective particle size which is ¼ or less of the wavelength of the light in the matrix material 16a, and a fluorescent material 16c.
Claims38
A semiconductor light-emitting device comprising:
- a semiconductor chip for emitting light having a wavelength in blue to ultraviolet regions;
- and
- a sealing portion formed in at least a partial region on a passage path on which the light is passed,
- wherein the sealing portion includes:
- a sealing material which is a composite material including a matrix material and particles made of an inorganic material which are distributed in the matrix material, the particle having an effective particle size which is ¼ or less of the wavelength of the light in the matrix material;
- and
- a fluorescent material.
A semiconductor light-emitting device comprising:
- a semiconductor chip for emitting light;
- and
- a sealing portion formed in at least a partial region on a passage path on which the light is passed,
- wherein the sealing portion includes a sealing material which is a composite material including a matrix material and particles made of an inorganic material which are distributed in the matrix material, the particle having an effective particle size which is ¼ or less of a wavelength of the light in the matrix material, and comprises a first sealing portion for covering the semiconductor chip and a second sealing portion formed outside the first sealing portion, and
- a first refractive index with respect to the wavelength of the light in the first sealing portion is larger than a second refractive index with respect to the wavelength of the light in the second sealing portion.
A semiconductor light-emitting device comprising:
- a semiconductor chip for emitting light;
- and
- a sealing portion formed in at least a partial region on a passage path on which the light is passed,
- wherein the sealing portion includes a sealing material which is a composite material including a matrix material and particles made of an inorganic material which are distributed in the matrix material, the particle having an effective particle size which is ¼ or less of a wavelength of the light in the matrix material, and has a refractive index with respect to the wavelength of the light, the refractive index being set to become smaller from an inner region near the semiconductor chip to an outer region.
A semiconductor light-emitting device comprising:
- a semiconductor chip for emitting light;
- and
- a sealing portion formed in at least a partial region on a passage path on which the light is passed,
- wherein the sealing portion includes a sealing material which is a composite material including a matrix material and particles made of an inorganic material which are distributed in the matrix material, the particle having an effective particle size which is ¼ or less of a wavelength of the light in the matrix material, and comprises a first sealing portion for covering the semiconductor chip and a second sealing portion formed outside the first sealing portion, and
- the particle included in the second sealing portion is made of a material which absorbs light in an ultraviolet region.
A semiconductor light-emitting device comprising:
- a semiconductor chip for emitting light having a wavelength in blue to ultraviolet regions;
- a sealing portion formed in at least a partial region on a passage path on which the light is passed;
- a holding material for holding the semiconductor chip;
- and
- a paste material having transparency for fixing the semiconductor chip and the holding material,
- wherein the paste material includes a composite material including a matrix material and particles made of an inorganic material which are distributed in the matrix material, the particle having an effective particle size which is ¼ or less of the wavelength of the light in the matrix material;
- and
- the particle is made of a material for absorbing light in an ultraviolet region.
Dependencies are inferred from the claim text.