Interconnect structure including hybrid frame panel

An electronic component, comprising:

• a base insulative layer having a first surface and a second surface;
• an electronic device having a first surface and a second surface, and the electronic device is secured to the base insulative layer;
• a first I/O contact located on the first surface of the electronic device;
• and
• a frame panel defining an aperture, wherein the electronic device is disposed within the aperture, and the frame panel is a multi-functional structure having:
• a first region secured to the base insulative layer, wherein the first region is defined by a relatively high affinity or adhesability to the base insulative layer;
• and
• a second region that has a relatively lower high affinity or adhesability to the base insulative layer, but a relatively higher dimensional stability, or resistance to stress, temperature or humidity, than the first region.