Lead cutter and method of cutting lead
AssigneeNEC Electronics Corporation
InventorTooru Kumamoto
Life of this patent
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Abstract
There is provided a lead cutter that enables micro-adjusting a cutting clearance between a punch and a die with high accuracy. The lead cutter includes a die on which the lead provided in an encapsulating resin enclosing a semiconductor chip is to be placed, a punch that vertically moves relative to the die to thereby cut the lead, and a temperature controller that controls a temperature of at least one of the punch and the die, so as to adjust a clearance between the punch and the die.
Claims12
A lead cutter comprising:
- a die on which an outer lead provided in an encapsulating resin enclosing a semiconductor chip is to be placed;
- a punch that vertically moves relative to said die to thereby cut said outer lead;
- and
- a temperature controller that controls a temperature of at least one of said punch and said die, so as to adjust a clearance between said punch and said die.
A method of cutting a lead that employs a punch and a die to cut an outer lead provided in an encapsulating resin enclosing a semiconductor chip, comprising:
- cutting said outer lead upon controlling a temperature of at least one of said punch and said die, thereby adjusting a clearance between said punch and said die.
Dependencies are inferred from the claim text.