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US 2009/0253271 A1Published application
Spin-on film processing using accoustic radiation pressure
AssigneeMicron Technology, Inc.
InventorsNishant Sinha, Gurtej S. Sandhu, John Smythe
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Abstract
An apparatus and process operate to impose sonic pressure upon a spin-on film liquid mass that exhibits a liquid topography and in a solvent vapor overpressure to alter the liquid topography. Other apparatus and processes are disclosed.
Claims28
A process, comprising:
- forming a spin-on film liquid topography upon a semiconductive substrate;
- imposing a solvent vapor at an overpressure on the spin-on film liquid topography;
- and
- imposing sonic radiation pressure onto the spin-on film liquid topography to alter the liquid topography.
1 more element
A process, comprising:
- forming a spin-on film liquid topography upon a semiconductive substrate;
- imposing sonic radiation pressure from a source onto the spin-on film liquid topography to alter the liquid topography and while eccentrically moving the source relative to the liquid topography;
- and
- imposing a solvent vapor at an overpressure on the spin-on film liquid topography.
1 more element
A process, comprising:
- forming a spin-on film liquid topography upon a semiconductive substrate;
- imposing a spin-on liquid solvent overpressure upon the spin-on film liquid;
- and
- imposing sonic radiation pressure onto the spin-on film liquid topography to alter the liquid topography, wherein imposing the sonic radiation pressure includes modulating at least one of frequency and amplitude of the sonic radiation pressure.
1 more element
Dependencies are inferred from the claim text.