Back to results
US 2009/0253232 A1Published application
Microwave Cure of Semiconductor Devices
OwnerGary Philip Thomson, Peter Joseph Sakakiniinventors
Life of this patent
Estimating the term…
Abstract
A method for curing an adhesive is disclosed. A preferred embodiment comprises securing a cover onto a substrate to enclose a MEMs device using an adhesive. The adhesive is either partially or fully cured using microwave radiation. Another preferred embodiment utilizes the microwave radiation to cure an encapsulant placed to protect a semiconductor device.
Claims20
A method for curing a semiconductor device adhesive, the method comprising:
- providing a substrate and a cover;
- applying an adhesive to at least one of the substrate or the cover;
- placing the substrate and the cover in contact with the adhesive;
- and
- volumetrically heating the adhesive with microwave radiation.
2 more elements
A method for bonding a semiconductor die to a substrate, the method comprising:
- providing the substrate and the semiconductor die;
- adhering the semiconductor die to the substrate by applying a single layer of an attach material between the substrate and the semiconductor die;
- at least partially curing the attach material by heating the attach material using microwave radiation.
A method of encapsulating a semiconductor device, the method comprising:
- providing a semiconductor device;
- applying an encapsulant to the semiconductor device;
- irradiating the encapsulant with microwave radiation to at least partially cure the encapsulant.
Dependencies are inferred from the claim text.