Minimizing Electromagnetic Interference in Coil Transducers
AssigneeAvago Technologies ECBU (Singapore) Pte. Ltd.
InventorsJulie E. Fouquet, Gary R. Trott, Richard Baumgartner
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Abstract
Disclosed herein are various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another.
Claims44
A coil transducer system, comprising:
- a coil transducer comprising a generally planar substrate comprising opposing upper and lower surfaces and including therein a dielectric barrier, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive coil disposed above the upper surface of the substrate, the first coil extending between first and second coil input terminals disposed at opposite ends thereof, a second electrically conductive coil disposed below the lower surface of the substrate, the second coil extending between first and second output coil terminals disposed at opposite ends thereof, and
- a transmitter circuit comprising first and second transmitter output terminals;
- wherein a first wire is electrically connected to, and extends between, the first transmitter output terminal and the first input coil terminal, a second wire is electrically connected to, and extends between, the second transmitter output terminal and the second input coil terminal, the first and second wires are substantially parallel to one another or exhibit substantially similar angles respecting a major axis of the coil transducer, the first and second wires have substantially a same first length, the first and second wires thereby being configured to minimize the pick-up of electromagnetic interference (“EMI”) thereby.
A method of making a coil transducer system, comprising:
- forming a coil transducer comprising a generally planar substrate comprising opposing upper and lower surfaces and including therein a dielectric barrier, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive coil disposed above the upper surface of the substrate, the first coil extending between first and second coil input terminals disposed at opposite ends thereof, a second electrically conductive coil disposed below the lower surface of the substrate, the second coil extending between first and second output coil terminals disposed at opposite ends thereof, and
- providing a transmitter circuit comprising first and second transmitter output terminals;
- electrically connecting a first wire between the first transmitter output terminal and the first input coil terminal;
- electrically connecting a second wire between the second transmitter output terminal and the second input coil terminal, and
- configuring the first and second wires to be substantially parallel to one another, or to exhibit substantially similar angles respecting an azimuth extending along a major axis of the coil transducer, and have substantially a same first length such that the first and second wires are configured to minimize the pick-up of electromagnetic interference (“EMI”) thereby.
Dependencies are inferred from the claim text.