Method and system for configuring a transformer embedded in a multi-layer integrated circuit (ic) package

Abstract

Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.

Dependencies are inferred from the claim text.