Method and system for processing signals via an oscillator load embedded in an integrated circuit (ic) package

Abstract

Aspects of a method and system for processing signals via an oscillator load embedded in an IC package are provided. In this regard, a hybrid circuit may comprise an oscillator, and a frequency of the oscillator may be controlled via a digital control word. Furthermore, the hybrid circuit may comprise an integrated circuit bonded to a multi-layer package and at least a portion of the oscillator may be within and/or on the multi-layer package. The at least a portion of the oscillator may be fabricated in one or more metal layers of the multi-layer package. The at least a portion of the oscillator in the multi-layer package may be fabricated utilizing microstrip and/or stripline transmission line. A frequency of the oscillator may be controlled via one or more inductors and/or capacitors in the portion of the oscillator in the multi-layer package.

Dependencies are inferred from the claim text.