Electrostatic chuck and manufacturing method thereof
AssigneeTokyo Electron Limited
InventorsTsuyoshi HIDA, Takashi Yamamoto
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Abstract
An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a width gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film. The thermally sprayed film covers at least a portion of the metal layer exposed at an inside of the groove such that the thermally sprayed film does not protrude from the groove.
Claims13
An electrostatic chuck of a stack structure comprising:
- a metal layer interposed between insulating layers;
- and
- a groove formed at a peripheral portion of the electrostatic chuck to have a width gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film.
A method of manufacturing an electrostatic chuck of a stack structure including a metal layer interposed between insulating layers, the method comprising:
- forming a groove at a peripheral portion of the electrostatic chuck to have a width gradually increasing toward an outside;
- forming a thermally sprayed insulating film to cover at least a portion of the metal layer exposed at the groove;
- and
- grinding the thermally sprayed film such that the thermally sprayed film does not protrude from the groove.
Dependencies are inferred from the claim text.