Imprinting method and stamper
AssigneeKabushiki Kaisha Toshiba
InventorsAkiko YUZAWA, Seiji MORITA, Shinobu SUGIMURA, Masatoshi SAKURAI
Life of this patent
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Abstract
According to one embodiment, an imprinting method includes applying a resist to a substrate, imprinting a stamper on which protruded patterns are formed against the resist applied to the substrate, forcing a distal end of a peeling wedge into a part between the substrate and the stamper, and introducing a gas between the substrate and the stamper to peel off the stamper from the substrate, in which a gap between the substrate and the stamper is made larger than a thickness of the resist at a part into which the distal end of the peeling wedge is forced.
Claims7
An imprinting method comprising:
- applying a resist to a substrate;
- imprinting a stamper comprising embossed patterns on the stamper against the resist applied to the substrate;
- applying a distal end of a peeling wedge between the substrate and the stamper;
- and
- introducing a gas between the substrate and the stamper in order to peel off the stamper from the substrate,
- wherein a gap between the substrate and the stamper is made larger than a thickness of the resist where the distal end of the peeling wedge is applied.
A stamper comprising embossed patterns on a surface of the stamper, wherein a thickness of an inner periphery or an outer periphery of the stamper is made substantially small.
Dependencies are inferred from the claim text.